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Title:
COMPOSITE DEVICE MANUFACTURING METHOD AND COMPOSITE DEVICE MANUFACTURED THEREBY
Document Type and Number:
WIPO Patent Application WO/2019/035559
Kind Code:
A1
Abstract:
A composite device manufacturing method which minimizes the occurrence of defects in a composite device, while easily adhering devices made of heterogeneous materials by laminating a bonding layer and other devices, after aligning and temporarily adhering the device to a thermoreactive adhesive substrate, and a composite device manufactured thereby are disclosed. The disclosed composite device manufacturing method comprises a step of preparing the thermoreactive adhesive substrate, a step of temporarily adhering a first device to the adhesive substrate, a step of forming a bonding layer on an upper surface of the first device, a step of laminating a second device on an upper surface of the bonding layer, a step of adhering the first device and the second device to manufacture the composite device, and a step of releasing the composite device from the adhesive substrate.

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Inventors:
YUN CHUL WON (KR)
HAN HEE GU (KR)
KIM TAE HONG (KR)
CHO SANG MIN (KR)
Application Number:
PCT/KR2018/007981
Publication Date:
February 21, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
AMOSENSE CO LTD (KR)
International Classes:
H01G4/40; H01C7/10; H05K9/00
Foreign References:
KR20100048044A2010-05-11
KR20120072870A2012-07-04
JPH10125564A1998-05-15
JPH06325978A1994-11-25
JP2002254417A2002-09-11
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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