Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOSITE ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/021529
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce the stress acting on a thin-film capacitor in a composite electronic component provided with the thin-film capacitor and a thin-film circuit element. This composite electronic component (1) is provided with: an insulating substrate (2) having a thin-film capacitor (3) formed on one main surface thereof; an insulating protective layer (4) stacked so as to cover the thin-film capacitor (3); first lead-out wiring (7a) which is formed on the insulating protective layer (4), and which is connected to the thin-film capacitor (3); a first resin-layer section (5a) stacked on the insulating protective layer (4); first and second thin-film resistors (9a, 9b) provided in the first resin-layer section (5a); a third through hole (6c) formed passing through the first resin-layer section (5a) in the thickness direction such that the first lead-out wiring (7a) can be seen therethrough; first rewiring (8a) which is formed on the first resin-layer section (5a), and which is connected to the first lead-out wiring (7a) through a second through hole (6c); and a second resin-layer section (5b) stacked on the first resin-layer section (5a). The inside of the third through hole (6c) is filled with the resin of the second resin-layer section (5b). The third through hole (6c) is formed in a position offset from the thin-film capacitor (3) in a planar view.

Inventors:
SHINDO, Satoshi (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
TAKESHIMA, Yutaka (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2015/071917
Publication Date:
February 11, 2016
Filing Date:
August 03, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01G4/33; H01G4/40; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Domestic Patent References:
WO2010016171A12010-02-11
Foreign References:
JP2004056097A2004-02-19
JP2001177004A2001-06-29
JP2004071589A2004-03-04
Attorney, Agent or Firm:
YANASE, Yuji et al. (4F TAKAGI BLDG, 1-19 Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
Download PDF: