COMPOSITE ELECTRONIC COMPONENT

Title:

COMPOSITE ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2023/276333

Kind Code:

A1

Abstract:

[Problem] To ensure sufficient inductance and suppress the occurrence of warpage in a composite electronic component comprising an insulation layer in which an electronic component is embedded. [Solution] A composite electronic component 1 comprises: an insulation layer 11; coil patterns C1, C2 that are provided on the side of one surface 11a of the insulation layer 11 and that are magnetically coupled to each other; coil patterns C3, C4 that are provided on the side of another surface 11b of the insulation layer 11 and that are magnetically coupled to each other; and an ESD protection component 2 that is embedded in the insulation layer 11 and is connected at least to the coil patterns C1, C2. This ensures sufficient inductance because the coil patterns are arranged on both sides of the insulation layer 11 in which the ESD protection component 2 is embedded. In addition, the occurrence of warpage is suppressed because the symmetry in the lamination direction is enhanced.

Inventors:

ABE TOSHIYUKI (JP)
TSUYUTANI KAZUTOSHI (JP)
OKUMURA TAKESHI (JP)
FURUHASHI KEITA (JP)
MIURA MITSURU (JP)
HASHIMOTO YUKI (JP)

Application Number:

PCT/JP2022/013415

Publication Date:

January 05, 2023

Filing Date:

March 23, 2022

Export Citation:

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Assignee:

TDK CORP (JP)

International Classes:

H01F17/00; H01F27/00; H05K1/16; H05K3/46

Domestic Patent References:

WO2014115434A1

2014-07-31

Foreign References:

JP2018170315A	2018-11-01
JP2006066848A	2006-03-09
JP2011249876A	2011-12-08
JP2013012702A	2013-01-17
JP2015043439A	2015-03-05

Attorney, Agent or Firm:

WASHIZU Mitsuhiro et al. (JP)

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