Title:
COMPOSITE EPOXY RESIN BOARD AND FORMING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/126436
Kind Code:
A1
Abstract:
Disclosed is a composite epoxy resin board, the preparation raw materials thereof include the following components in weight percentages: 5% to 100% of a waste prepreg powder, and 0 to 95% of a waste printed circuit board powder. The waste prepregs are used as the main preparation raw materials, not only realizing the recycling and reuse of prepreg scraps, but also reducing the use of glue adhesives, and even eliminating the addition of glue adhesives, due to the very high epoxy resin content in the prepregs and the excellent bonding strength of the epoxy resin able to replace other glue adhesives, and also reducing the glue-mixing time in the forming process, thereby simplifying the forming technology.
Inventors:
SONG DANGJI (CN)
Application Number:
PCT/CN2017/070415
Publication Date:
July 12, 2018
Filing Date:
January 06, 2017
Export Citation:
Assignee:
GUANGDONG OUMING NEW MATERIAL TECH CO LTD (CN)
International Classes:
C08L63/00; B29D7/01; C08K3/08; C08K3/26; C08L23/06; C08L27/06; C08L61/06; C08L97/02
Foreign References:
| CN103044772A | 2013-04-17 | |||
| CN101670357A | 2010-03-17 | |||
| CN102911458A | 2013-02-06 | |||
| CN102218872A | 2011-10-19 | |||
| CN103848587A | 2014-06-11 | |||
| US20160001527A1 | 2016-01-07 |
Attorney, Agent or Firm:
CHANGSHA CHUWEI INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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