Title:
COMPOSITE FILM FOR ELECTRONIC DEVICES USING HIGH FREQUENCY BAND SIGNALS, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/016534
Kind Code:
A1
Abstract:
Provided is a composite film for electronic devices using high frequency band signals, the composite film having a low dielectric loss tangent, excellent embedding properties with respect to the protrusions and recesses of a circuit or the like, excellent surface smoothness, and high adhesiveness with plated copper. Also provided is a printed wiring board containing a cured article of the composite film for electronic devices, and a method for manufacturing the printed wiring board. The composite film for electronic devices is specifically a composite film for electronic devices using high frequency band signals, the film comprising: a layer A having a minimum melt viscosity at 80-150℃ of 100 to 4,000 Pa・s; and a layer B having a minimum melt viscosity at 80-150℃ of 50,000 Pa・s or greater. The composite film for electronic devices exhibits low thermal expansion, and has excellent film handling properties.
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Inventors:
KASAHARA AYA (JP)
IWAKURA TETSUROU (JP)
IWAKURA TETSUROU (JP)
Application Number:
PCT/JP2017/026132
Publication Date:
January 25, 2018
Filing Date:
July 19, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/03; B32B27/00; B32B27/34; H05K3/46
Domestic Patent References:
| WO2015152427A1 | 2015-10-08 |
Foreign References:
| JP2013127014A | 2013-06-27 | |||
| JP2015224304A | 2015-12-14 | |||
| JP2016017091A | 2016-02-01 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
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