Title:
COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/243903
Kind Code:
A1
Abstract:
Disclosed are a composite film, a rigid flexible printed circuit board, and an electronic device comprising same. The present invention relates to a composite film, a rigid flexible printed circuit board using same, and an electronic device. According to an embodiment, the composite film comprises: a base film layer; a first metal thin film layer formed on one surface of the base film layer; and a second metal thin film layer formed on the opposite surface, wherein the first metal thin film layer and the second metal thin film layer include a soft etching treatment area and an oxide surface treatment area, and the surface roughness of the soft etching treatment area and the oxide surface treatment area are different from each other. Various other embodiments are possible.
Inventors:
KIM BYEONGKEOL (KR)
LEE YOUNGSUN (KR)
HONG EUNSEOK (KR)
LEE YOUNGSUN (KR)
HONG EUNSEOK (KR)
Application Number:
PCT/KR2023/007291
Publication Date:
December 21, 2023
Filing Date:
May 26, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B32B15/08; B32B3/30; B32B7/12; B32B15/20; H05K1/09; H05K3/28; H05K3/46
Foreign References:
| KR20060096653A | 2006-09-13 | |||
| KR20200121948A | 2020-10-27 | |||
| KR20090063223A | 2009-06-17 | |||
| KR20110045991A | 2011-05-04 | |||
| KR20210000611A | 2021-01-05 | |||
| US20080245549A1 | 2008-10-09 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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