Title:
COMPOSITE IC MODULE
Document Type and Number:
WIPO Patent Application WO/2002/086811
Kind Code:
A1
Abstract:
A composite IC module with much less malfunction of a signal or its reading failure and easy of managing cells with the packaging of an IC and peripheral components compatible with both contact-system and non-contact-system functions of signal transmission/reception in response to external apparatuses. This module is constituted by integrating an IC containing a memory or an IC containing a memory and a CPU, a contact mechanism for electric response to a first external device, a coupling mechanism for non-contact response to the first external device or a second external device, and a capacitor and/or secondary cell which is charged by an external charger via a contact mechanism and/or coupling mechanism and feeds power to the IC and the coupling mechanism.
Inventors:
ARIMURA KUNITAKA (JP)
Application Number:
PCT/JP2002/003815
Publication Date:
October 31, 2002
Filing Date:
April 17, 2002
Export Citation:
Assignee:
SMART CARD CO LTD (JP)
ARIMURA KUNITAKA (JP)
ARIMURA KUNITAKA (JP)
International Classes:
B42D25/369; G01S13/75; G01S13/76; G01S13/79; G06K19/07; G06K19/077; B42D15/10; H02J7/00; (IPC1-7): G06K19/07; G01S13/75; H02J7/00; H02J17/00; B42D15/10
Foreign References:
| JP2000227949A | 2000-08-15 | |||
| JPH02165311A | 1990-06-26 | |||
| JPH04340328A | 1992-11-26 |
Attorney, Agent or Firm:
KYOSEI INTERNATIONAL PATENT OFFICE (8-14 Akasaka 3-chom, Minato-ku Tokyo, JP)
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