Title:
COMPOSITE MATERIAL COMPOSITION AND PASTE MATERIAL INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2016/157631
Kind Code:
A1
Abstract:
The purpose of the present invention is to improve the adhesiveness and tight adhesion of a composite material to substrates such as copper, silver, aluminum, silicon, and ferrite by compositing a low-melting-point glass which is used for sealing, bonding, formation of electroconductive joints, etc., with a resin material. The composite material composition according to the present invention comprises a low-melting-point glass component and a resin component containing neither hydroxy groups nor amino groups, and is characterized in that the low-melting-point glass component comprises V2O5, TeO2, and Ag2O, the total content of V2O5, TeO2, and Ag2O in the low-melting-point glass component being 78 mol% or higher and the contents of TeO2 and Ag2O each being one to two times by mole the content of V2O5, at least one oxide selected from among BaO, WO3, and P2O5 is contained as a first additional ingredient in an amount of 0-20 mol% of the low-melting-point glass component, and at least one oxide selected from among Y2O3, La2O3, Al2O3, and Fe2O3 is contained as a second additional ingredient in an amount of 0.1-2.0 mol% of the low-melting-point glass component.
Inventors:
KAJIHARA YURI (JP)
NAITOU TAKASHI (JP)
ARAI TADASHI (JP)
AOYAGI TAKUYA (JP)
MURAKI TAKAHITO (JP)
AMOU SATORU (JP)
NAITOU TAKASHI (JP)
ARAI TADASHI (JP)
AOYAGI TAKUYA (JP)
MURAKI TAKAHITO (JP)
AMOU SATORU (JP)
Application Number:
PCT/JP2015/084607
Publication Date:
October 06, 2016
Filing Date:
December 10, 2015
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/40; C09J9/02; C09J201/00; H01B1/22; C03C8/16; C03C14/00
Domestic Patent References:
| WO2014073086A1 | 2014-05-15 | |||
| WO2014102915A1 | 2014-07-03 | |||
| WO2012020694A1 | 2012-02-16 |
Foreign References:
| JP2013133343A | 2013-07-08 | |||
| JP2013133342A | 2013-07-08 | |||
| JP2013032255A | 2013-02-14 | |||
| JP2013103840A | 2013-05-30 | |||
| JPH05175254A | 1993-07-13 | |||
| JPH08259262A | 1996-10-08 | |||
| US5336644A | 1994-08-09 |
Attorney, Agent or Firm:
HIRAKI Yusuke et al. (JP)
Yusuke Hiraki (JP)
Yusuke Hiraki (JP)
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