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Patent Searching and Data


Title:
COMPOSITE MATERIAL FORMING METHOD AND COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/116700
Kind Code:
A1
Abstract:
Provided are: a composite material forming method that makes it easy to use a composite material in combination with another member to which the composite material is bonded, said composite material being formed by reacting a resin; and a composite material. A composite material forming method according to the present invention comprises: a first material preparation step (a magnetic field circuit forming material preparation step S11), a second material preparation step (a magnetic field circuit non-forming material preparation step S12), a material assembly step S13, and a first heating step (a magnetic field heating step S14). In the first material preparation step, a first material that contains a first resin is prepared. In the second material preparation step, a second material that contains a second resin is prepared. In the material assembly step S13, the first material and the second material are assembled. In the first heating step, the assembled first and second materials are heated under such conditions where the first resin is mainly reacted in comparison to the second resin, so that the first resin is mainly reacted in comparison to the second resin, thereby bonding the first material and the second material with each other.

Inventors:
KAMO SOTA (JP)
TAKAGI KIYOKA (JP)
TAKAYANAGI TOSHIYUKI (JP)
Application Number:
PCT/JP2018/037750
Publication Date:
June 20, 2019
Filing Date:
October 10, 2018
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C70/06; B29C43/52; B29C65/04
Foreign References:
JP2017196768A2017-11-02
JP2008238574A2008-10-09
JPH05507769A1993-11-04
JP2014116293A2014-06-26
Other References:
See also references of EP 3708344A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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