COMPOSITE MATERIAL FOR HEAT DISSIPATING SUBSTRATE, AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL FOR HEAT DISSIPATING SUBSTRATE

Title:

COMPOSITE MATERIAL FOR HEAT DISSIPATING SUBSTRATE, AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL FOR HEAT DISSIPATING SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2013/011668

Kind Code:

A1

Abstract:

Provided are: a composite material for heat dissipating substrates, which achieves both the high heat conductivity and the low thermal expansion rate, and has satisfactory performance as heat dissipating substrates; and a method for manufacturing the composite material, wherein the composite material can be manufactured at low cost. In order to provide the composite material and the method, a composite material for heat dissipating substrates is manufactured by means of a powder-metallurgical method. The composite material for heat dissipating substrates, said composite material having been manufactured by the manufacturing method, contains an aluminum alloy and a silicon carbide, and particles of the silicon carbide are in contact with each other.

Inventors:

ISHIDO KAORU (JP)
ISHII HIDEKI (JP)
WATANABE SHIGEHISA (JP)
HORI HISASHI (JP)

Application Number:

PCT/JP2012/004490

Publication Date:

January 24, 2013

Filing Date:

July 11, 2012

Export Citation:

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Assignee:

NIPPON LIGHT METAL CO (JP)
ISHIDO KAORU (JP)
ISHII HIDEKI (JP)
WATANABE SHIGEHISA (JP)
HORI HISASHI (JP)

International Classes:

B22F3/17; B22F1/00; B22F3/10; C22C1/10; C22C21/00; C22C21/02; H01L23/373

Domestic Patent References:

WO2003040420A1

2003-05-15

Foreign References:

JP2000192168A	2000-07-11
JP2001158933A	2001-06-12
JP2003078087A	2003-03-14
JP2004003023A	2004-01-08
JPH02243729A	1990-09-27
JPH01501489A	1989-05-25
JPH09157773A	1997-06-17
JPH10335538A	1998-12-18
JPH11106848A	1999-04-20

Other References: