Title:
COMPOSITE MATERIAL, HEAT SINK, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/205782
Kind Code:
A1
Abstract:
A composite material according to the present disclosure comprises a plurality of diamond particles and at least one first element selected from the group consisting of copper, silicone, chromium, cobalt, nickel, molybdenum, titanium, vanadium, niobium, tantalum and tungsten, in which the content ratio of the first element relative to the total mass of copper and the first element is 50 to 2000 ppm, inclusive.
Inventors:
MAJIMA MASATOSHI (JP)
TOYOSHIMA GOUHEI (JP)
TAKASHIMA KOUICHI (JP)
TOYOSHIMA GOUHEI (JP)
TAKASHIMA KOUICHI (JP)
Application Number:
PCT/JP2021/008039
Publication Date:
October 14, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
ALMT CORP (JP)
ALMT CORP (JP)
International Classes:
C22C1/05; C22C26/00; C25D7/00; H01L23/373
Domestic Patent References:
| WO2019163721A1 | 2019-08-29 |
Foreign References:
| JP2017075397A | 2017-04-20 | |||
| JPH04259305A | 1992-09-14 | |||
| JP2020070227A | 2020-05-07 | |||
| JP2004197153A | 2004-07-15 | |||
| JP2003309316A | 2003-10-31 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: WORK VEHICLE CAB, WORK VEHICLE, AND BULLDOZER
Next Patent: OBSERVATION DEVICE AND OBSERVATION METHOD
Next Patent: OBSERVATION DEVICE AND OBSERVATION METHOD