Title:
COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2017/030099
Kind Code:
A1
Abstract:
Disclosed is a composite material provided with a metal material and a protective member which is a cured curable resin composition provided on a surface of the metal material. The curable resin composition contains radical-polymerizable monomers including a first monofunctional radical-polymerizable monomer and a second monofunctional radical-polymerizable monomer. The first monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 20°C or lower when polymerized independently. The second monofunctional radical-polymerizable monomer is a monomer for forming a homopolymer having a glass transition temperature of 50°C or above when polymerized independently.
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Inventors:
TAKEUCHI KAZUMASA (JP)
YOKOYAMA KOSUKE (JP)
SHIRASAKA TOSHIAKI (JP)
OCHIAI BUNGO (JP)
CHIBA KAZUKI (JP)
KIRYU TOMONARI (JP)
YOKOYAMA KOSUKE (JP)
SHIRASAKA TOSHIAKI (JP)
OCHIAI BUNGO (JP)
CHIBA KAZUKI (JP)
KIRYU TOMONARI (JP)
Application Number:
PCT/JP2016/073792
Publication Date:
February 23, 2017
Filing Date:
August 12, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F220/18; C08J5/00; C08L33/10
Domestic Patent References:
| WO2013054895A1 | 2013-04-18 |
Foreign References:
| JP2011121359A | 2011-06-23 | |||
| JP2012041491A | 2012-03-01 | |||
| JP2016060884A | 2016-04-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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