Title:
COMPOSITE METAL FOIL, COMPOSITE METAL FOIL WITH CARRIER, METAL-CLAD LAMINATE OBTAINED USING SAID COMPOSITE METAL FOIL OR SAID COMPOSITE METAL FOIL WITH CARRIER, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2015/099156
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composite metal foil for the production of a printed wiring board, which has a good balance among three characteristics, namely low thermal expansion properties better than those of copper, good electrical conduction performance and good solubility in a copper etching liquid. In order to achieve this purpose, the present invention employs a composite metal foil which is composed of one or more copper layers and one or more nickel alloy layers, and which is characterized in that: the one or more nickel alloy layers are formed of a nickel-molybdenum alloy; and if TCu is the total thickness of the one or more copper layers and TNi-Mo is the total thickness of the one or more nickel-molybdenum alloy layers, TCu and TNi-Mo satisfy the relationship 0.08 ≤ TNi-Mo/TCu ≤ 1.70.
Inventors:
SHIMIZU YOSHINORI (JP)
MATSUDA MITSUYOSHI (JP)
MATSUDA MITSUYOSHI (JP)
Application Number:
PCT/JP2014/084642
Publication Date:
July 02, 2015
Filing Date:
December 26, 2014
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/01; C25D7/06; H01B5/02; H05K1/09
Domestic Patent References:
| WO2011086972A1 | 2011-07-21 |
Foreign References:
| JP2003011273A | 2003-01-15 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
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