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Title:
COMPOSITE OF METAL AND RESIN
Document Type and Number:
WIPO Patent Application WO/2019/026382
Kind Code:
A1
Abstract:
A metal article characterized by including a metal substrate, a resin substrate, and a compound layer for bonding the metal substrate and resin substrate; the compound layer being a first compound layer containing a first compound that has a nitrogen-containing functional group and a silanol group, and a second compound that is an alkane-type amine-based silane coupling agent; and the first compound not containing sulfur atoms.

Inventors:
HIRAI, Kinji (INC. 616-3, Aza Minakami, Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
AKIYAMA, Isamu (INC. 616-3, Aza Minakami, Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
TAKAHASHI, Tsukasa (INC. 616-3, Aza Minakami, Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
SUGAYA, Takutaka (INC. 616-3, Aza Minakami, Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
MUTO, Yuka (INC. 616-3, Aza Minakami, Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
Application Number:
JP2018/018588
Publication Date:
February 07, 2019
Filing Date:
May 14, 2018
Export Citation:
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Assignee:
ADVANCED TECHNOLOGIES, INC. (616-3, Aza Minakami Jinba, Gotenba-sh, Shizuoka 47, 〒4120047, JP)
International Classes:
B32B15/08; B05D3/02; B05D3/10; B05D7/24; C09D183/04; C09J201/06; H05K3/38
Domestic Patent References:
WO2012046651A12012-04-12
WO2013186941A12013-12-19
WO2017130721A12017-08-03
Foreign References:
JP2007262126A2007-10-11
JP2005262506A2005-09-29
JP2008174604A2008-07-31
JP2011012002A2011-01-20
JP2012035631A2012-02-23
JPH0539295A1993-02-19
US20050214553A12005-09-29
US20020132056A12002-09-19
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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