Title:
COMPOSITE MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/235447
Kind Code:
A1
Abstract:
Provided is a composite molded body wherein a hard member and a soft member are integrated and adhesion of the soft member to the hard member is not easily decreased even if the soft member comes into contact with chemicals such as hand cream and sunscreen, and which is therefore capable of easily maintaining the initial adhesive power. A composite molded body 10, wherein a hard part 11 that is formed from a hard resin and a soft part 12 that is formed from a soft resin are integrated, is configured such that: the soft part contains a binder 12a that is composed of an organopolysiloxane which has dimethyl silicone as the main skeleton and a silicone rubber powder 12b; and 10-30% by volume of the silicone rubber powder 12b is contained in the total of 100% by volume of the binder 12a and the silicone rubber powder 12b.
Inventors:
ARAI REIKA (JP)
Application Number:
PCT/JP2018/018294
Publication Date:
December 27, 2018
Filing Date:
May 11, 2018
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
B32B27/00; B32B25/20; C08J7/043; C08J7/046; C08L83/04
Foreign References:
| JP2004107642A | 2004-04-08 | |||
| JP2005297234A | 2005-10-27 | |||
| JP2006182936A | 2006-07-13 | |||
| JP2006274122A | 2006-10-12 | |||
| JPH0825577A | 1996-01-30 |
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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