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Patent Searching and Data


Title:
COMPOSITE MOLDING AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/032170
Kind Code:
A1
Abstract:
Provided are: a composite molding in which a thin rubber layer is formed on the surface of a resin molding; and a production method therefor. According to the present invention, a thin cross-linked rubber layer is formed by applying, on the surface of a molding of a resin such as a polyamide-based resin including an amino group, a liquid composition containing a peroxide and a rubber component such as rubber latex, and causing cross-linking to occur in an uncross-linked rubber layer. Improved adhesion to the resin molding can be achieved with the use of a co-cross-linking agent even when the cross-linked rubber layer is of a thin construction.

Inventors:
MUTSUDA MITSUTERU (JP)
KITADA MASARU (JP)
Application Number:
PCT/JP2019/031354
Publication Date:
February 13, 2020
Filing Date:
August 08, 2019
Export Citation:
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Assignee:
DAICEL EVONIK LTD (JP)
NAKANO MFG CO LTD (JP)
International Classes:
B32B25/08; B05D7/02; B05D7/24; B32B25/16; B32B27/34; C08J7/04
Foreign References:
JP2001150618A2001-06-05
JP2011110105A2011-06-09
JP2013532194A2013-08-15
JP2005036147A2005-02-10
JP2002273826A2002-09-25
JPH09124803A1997-05-13
JPH03138114A1991-06-12
JP2005036147A2005-02-10
JP2002273826A2002-09-25
JP2011110105A2011-06-09
Other References:
See also references of EP 3835058A4
Attorney, Agent or Firm:
KUWATA Mitsuo et al. (JP)
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