Title:
COMPOSITE MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/211897
Kind Code:
A1
Abstract:
This composite multilayer substrate is provided with: a first multilayer substrate (1) which comprises a plurality of laminated first base materials (11-14); and a second multilayer substrate (2) which comprises a plurality of laminated second base materials, while having a first main surface, a second main surface and two lateral surfaces. The second base materials have a lower elastic modulus and a lower relative dielectric constant than the first base materials; and the second multilayer substrate (2) is arranged in the first multilayer substrate (1) so that the first main surface and two lateral surfaces of the second multilayer substrate (2) are surrounded by the first base materials. The second multilayer substrate (2) is provided with a high-frequency circuit.
Inventors:
TANIGUCHI KATSUMI (JP)
Application Number:
PCT/JP2018/015861
Publication Date:
November 22, 2018
Filing Date:
April 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01L23/12; H01L23/32
Domestic Patent References:
| WO2016088693A1 | 2016-06-09 |
Foreign References:
| JP2015179833A | 2015-10-08 | |||
| JP2002223050A | 2002-08-09 | |||
| JPH118444A | 1999-01-12 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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