Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/145258
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass%, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass%, and these particles satisfy the relationships W1

Inventors:
KOMATSU TERUO (JP)
MATSUBAYASHI RYO (JP)
Application Number:
PCT/JP2012/058570
Publication Date:
October 03, 2013
Filing Date:
March 30, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
APPLIED NANOPARTICLE LAB CORP (JP)
SHINDENGEN ELECTRIC MFG (JP)
KOMATSU TERUO (JP)
MATSUBAYASHI RYO (JP)
International Classes:
B22F1/054; B22F1/102; B23K20/00; H01B1/00; H01B1/22; H01L21/52; H05K1/09
Foreign References:
JP2010050189A2010-03-04
JP2011058041A2011-03-24
JP2004107728A2004-04-08
JP4680313B22011-05-11
JPH07320535A1995-12-08
JP4600282B22010-12-15
JP2011058041A2011-03-24
Other References:
See also references of EP 2832472A4
Attorney, Agent or Firm:
MIKI HISAMI (JP)
Hisami Miki (JP)
Download PDF: