COPPER/NIOBIUM COMPOSITE PIPING MATERIAL PRODUCED BY COPPER ELECTROFORMING, PROCESS FOR PRODUCING THE SAME AND SUPERCONDUCTING ACCELERATION CAVITY PRODUCED FROM THE COMPOSITE PIPING MATERIAL

Title:

COPPER/NIOBIUM COMPOSITE PIPING MATERIAL PRODUCED BY COPPER ELECTROFORMING, PROCESS FOR PRODUCING THE SAME AND SUPERCONDUCTING ACCELERATION CAVITY PRODUCED FROM THE COMPOSITE PIPING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2006/129602

Kind Code:

A1

Abstract:

For industrially advantageous production of an electroformed copper/niobium composite piping material in which the electroformed copper layer and the niobium thin piping material are strongly boned to each other, a nickel thin-film is applied to the surface of either an outer circumference or inner circumference, or both, of a niobium thin piping material, and the nickel thin-film at its surface is coated with copper by electroforming technique, followed by annealing, so as to obtain the intended electroformed copper/niobium composite piping material.

Inventors:

SAITO KENJI (JP)
IKEDA TOKUMI (JP)
HIGUCHI TAMAO (JP)

Application Number:

PCT/JP2006/310662

Publication Date:

December 07, 2006

Filing Date:

May 29, 2006

Export Citation:

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Assignee:

HIGH ENERGY ACCELERATOR RES (JP)
NOMURA PLATING CO LTD (JP)
SAITO KENJI (JP)
IKEDA TOKUMI (JP)
HIGUCHI TAMAO (JP)

International Classes:

C25D5/28; B21C37/06; C25D5/12; C25D5/50; C25D7/04; H05H13/04

Foreign References:

JPS5028902B1	1975-09-19
JPS60211097A	1985-10-23
JPS60261202A	1985-12-24
JPS5433232A	1979-03-10

Other References: