This Application is related to and; claims the benefit of priority of U.S. Provisional Application No, 62/563,695, entitled COMPOSITE POLYESTER FILMS FOR HEAT

SEALING TO NON-POLAR SUBSTRATES, filed on 27 September 2017, the contents of which are incorporated herein by reference in their entirety for aii purposes.

BACKGROUND OF THE INVENTION

Polymer films capable of being heat sealed to non-polar substrates have become increasingly important since more and more meal manufacturers are switching to polypropylene (PP) trays in order to save cost. Also, the market for induction sealing cap liners for high density poiyethyiene (HDPE) and PP containers in the pharmaceuticai and food industries has been steadily growing. Ethylene vinyl acetate (EVA) resins have conventionally been used for such applications, but these have tended to produce relatively weak seals to PP and HDPE and this has restricted applicability in many applications. Alternative heat sea! adhesives employing traditional low density polyethylene have been introduced, but these tend to have a rather narrow operating temperature window for the heat sealing process, and they cannot be applied by solvent coating to ail poiymer substrates (e.g. cannot be applied to polyester substrates) due to their extremeiy poor solubility in common organic solvents. Thus, polymer films (for example polyester films) having heat seal layers addressing these issues would represent a eicome advance in the packaging art.

SUMMARY OF THE INVENTION

Broadly one aspect of the invention provides a composite fiim comprising:

a) a self-supporting layer of a polymer film, (optionally the polymer film comprising a poiar poiymer and/or a poiyoiefin poiymer) and further optionatiy oriented in at least one direction),

b) an optional primer layer on the poiymer film, and i between the polymer film and a heat seal iayer (c), wherein the optionai primer layer comprises a halo polyvinyldine poiymer, an acrylic resin and/or a vinyl resin; and

wherein the heat seal layer comprising a heat seal composition is either disposed on the optional primer iayer where present, or directly o a surface of the poiymer film in the absenc of the optional primer iayer (b),

wherein the heat seal composition comprises a poiyoiefin p!astomer (POP) resin and a tackifier; and where

(i) the tackifier is present in an amount of at least 20% by weight of the heat seal composition, the total weight of the heat seal composition being 100%; and (si) the POP resin is present in an amount of no more that 80% by weight of the heat sea! composition, the total weight of the heat sea! composition being 100%; and where

(Mi) the optional primer layer is only absent when the polymer film comprises polyoiefsn and where in the absence of the optsona! primer layer (b), the surface of the polymer film in contact wit the heat layer (c) has been corona treated.

The composite film may comprise the heat seal composition which further comprises an acrylic resin and/or a vinyl resin.

The composite film may comprise the halo poiyvinyldiene polymer in the optional primer layer (b) that comprises, a PVdX resin where X is halo (e.g. X is chloro), more preferably a PVdC resin, most preferably consists of a PVdC resin,

The composite film may comprise the acrylic resin and/or the vinyl resin present in the optional primer layer (b) and/or the heat seal layer (c), the acrylic resin and/or the vinyl resin being selected from the group consisting of: Cn-4 a!kyi vinyl acetate resin and Ci- (meth). acrylic acid resin, preferably from the group consisting of: ethyla acryiate (EA) _f ethylene vinyl acetate (EVA), ethyl acrylic acid (EAA) and ethyl mefehacrylic acid (EMA).

The composite film may comprise the POP resin In the heat sea! !ayer (c), suitable POP resins being further defined herein,

The DSC melting point of the POP resin may be below iOQ°C

The mo!ecu!ar weights (such as weight average (M _w ) and number average (Μ«) of the polymers and resins described herein may be determined by any suitable method known to those skilled in the art, such as by experiment (e.g. GPC, SEC etc.) and/or theoretical calculations. A method to measure M« and M _n is described in

"Determination of Number-Average and Weight-Average Molecular Weights of Polymer Sampie from Diffusion and Sedimentation Velocity Measurements in Theta Solvent" by Okabe and Matsuda, Vol 28, pages 2325 to 23339, Journal of Applied Polymer Science, which article is encorporated herein by reference.

The amount of o(aipha)~oiefin co-monomer in the POP resin may be from 5 to 85 mol% based on the totai amount of POP resin being 100 mo!%.

The composite film may comprise the POP resin is present in an amount of no more than 75% by weight, the total weight of the heat seal composition being 100%,

The composite film may comprise the tackifier whic is a tackifier resin and preferably which constitutes at least 25% by weight of the heat seal composition, the totai weight of the heat seai composition being 100%,

The composite film may comprise at least one polyester selected from the grou consisting of polyethylene terephthalate (PET), polylactie acid (PLA),

po!yhydroxybutyrate (PHB), polyethylene furanoate (PEF) and polyethylene naphtha!ate (PEN). Another aspect of the invention provides a method of making th composite fiim of the invention comprising the steps of:

(i) applying a coating composition comprising th heat sea! composition in a solvent to either the primer layer on the polymer film (such as to a polar film for example to a polyester film) or in the absence of the optiona! primer layer, directly to the surface of th polymer film that has been corona treated, and then;

(ii) evaporating the solvent, wherein the heat seal composition comprises a poSyoiefin piastomer (POP) resin,

a tackifier resin present in an amount of at least 20% by weight, the heat seal composition being 100%, and optionally an acrylic resin and/or a vinyl resin, preferably an EVA resin,

A further aspect of the invention provides a method of bonding a polymer film to a container or a self-supporting film, comprising heat sealing a composite film of the invention as described herein to a surface of the container or the self-supporting film. The surface may be the surface of a poSyoiefin, for example a polypropylene (PP) and/or high density polyethylene (HDPE) surface. The heat sealable composite film of the invention may be an unprimed poSyoiefin fiim or a primed polar fi!m (such as a primed poiyester film) that comprises thereon the heat seal layer as described herein,

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows peel strength as a function of the temperature at which heat sealing was performed, for a composite film, comprising a primed poiyester film coated with a heat seai composition, heat sealed to an HDP£ substrate according to the invention, compared with heat seaiing a prior art film bearing an extrusion-coated EV heat seal layer,

FIG. 2 shows pee! strength results for runs analogous to those depicted in

FIG. i, with a polypropylene substrate instead of an HDPE substrate.

DETAILED DESCRIPTION OF THE INVENTION

The invention provides composite films providing excellent heat seal strength to a variety of substrates, including non-polar substrates such as polyolefin substrates e.g. PP and HDPE. The composite films have a very broad temperature window for heat sealing to the substrates, and offer the advantage that they can be applied by solvent coating. The composite films have conveniently low heat seal initiation temperatures and provide relatively constant peel strength as a function of heat sea! temperature, compared with fi!ms using traditiona! heat seal compositions. This allows shorter dwell time in the heat sealing process, which benefits process efficiency.

As used herein, the term "heat seal initiation temperature" Is the temperature at which seaiing at 80 psi {~ 552 kPa) for l second produces a peel strengt to an HDPE substrate of at least 350 g force / inch (~ 135 N / m). The heat seal initiation temperature is the minimum temperature at which the sealing polymer is molten enough to flow and to meit-bond t an adjacent layer in the seal. Below this

temperature, the coating vviii have insufficient bonding strength to the substrate. In many packaging line applications, sealing temperatures considerably above the heat seai initiation temperature are commoniy used to ensure sufficient seal strength.

Heat seal initiation temperatures for compositions of composite films useful for the invention are typicaiiy no higher than 265°F (~ 129°C) or 275°F (~ 141°C).

Moreover, the compositions of the composite films according to various embodiments of the invention provide remarkably little change in pee! strength over a wid range of sea! temperatures, compared with typical extrusion-coated products- The pee! strength for heat sea!s produced 275°F (~ 141°C) is typicaiiy at least 70% of that produced at 400°F (~ 204 ^ΰ €), or at least 75%, Or > 80% or > 85%, or > 90%.

Composite films according to the inventio typicaiiy provide a pee! strength, when applied to arv HDPE substrate at 30O°F (~ i49°C), and 80 psi (~ 552 kPa) for 1 second, of at least 350 g force / inch (~ 135 N / m), or at least 500, or 700, or > 900, or > 925, or > 950, or > 975, or > 1000, or > 1025 g force / inch (respectively > ~193 M / m, > ~270 N / m, > ~347 N / m, > ~357 N / m, > ^« 367 N / ^' m, > ^« 376 N / m,≥ -386 N / m &≥ -396 H / m).

The inventors have found that, due to the high tackifier content of the heat sea! compositions of the invention, these heat seai compositions cannot typicaiiy be appiled by extrusion coating, due to poor chili roll release, The inventors have solved this problem by soivent coating the heat seal compositions onto a primed substrate, where the primed substrate composes a primer layer on a polar polymer film (such as a polyester). The heat sea! compositions can also be coated onto an unprimed substrate, where the unprimed substrate comprises a polyo!efin polymer film , which may be corona treated optionally, as an alternative to use of a primer coating, though use of a primer is stiii preferred to provide improved adhesion of the heat sealing iayer to the polymer film as it may prevent deiamination of the composite film under a wider range of conditions. The present invention also addresses issues with heat stability that prevent certain types of tackifier resins from being used In extrusion coating. For example, tackifiers having a low softening point (e.g.> Piccolyte® C85 resin, softening point 82 - 83°C) may cause smoking under typical extrusion coating conditions.

Composite films of the invention may be heat sealed to a container or a seif-supporting film, using the heat seal layer as the contacting layer with the container or with the self-supporting film. The container may be pre-formed, and the surface of the container that is to be joined to the composite film may be made of any material. Suitable exemplary materials include glass metals, and polymers. Exemplary polymers include nyions and polyesters, including polyesters that are not themselves heat sealabie, for example polyethylene terephthaiate (PET) homopoiymer. Most

particularly, the material may be HDPE or PP. If the composite flim is instead heat sealed to a self-supporting film, the surfac of the self-supporting film to which the composite film is heat sealed may be made from any of these same materials.

The composite films of the invention include a self-supporting layer of a polymer film, an optional primer layer on the polymer film {optional if the polymer film is a corona treated polyolefin film), and a heat seal layer on the primer layer or directly on an unprimed corona treated polymer film In the absence of the optional primer layer. Typically, ail of these layers are coextensive,

The heat seal layer includes a heat seal composition comprising one or more acrylic resin(s) and/or vinyl resin(s), preferably EVA, EAA or EMA, more preferably EVA resin(s), one o more tackifser(s) {e.g. tackifier resin(s)), and one or more polyolefin plastomer (POP) resin(s). Each of the components of the composite film wilt be discussed in detail herein, including a description of the components i the heat seal layer.

A yet further aspect of the Invention provides use of a film of the invention as described herein as a heat sealable component of a packaging article (for example an ovenable food container) and/or as a liner for a cap for a packaging article.

A still further aspect of the invention provides a packaging article comprising a composite film of the invention as described herein, for example the packaging article comprising an ovenable food containe optionally comprising a HDPE or P tray and/or a cap for a packaging article lined with a composite film of the invention as described herein.

Acrylic resin and/or vinyl resins

Acrylic resins and/or vinyl resins refer to sub sets of resins which may be obtained and/or obtainable from at least one polymer precursor (Le. which itself may be polymeric e.g. an oligomer or a monomer) which comprise an activated unsaturated moiety.

The term "activated unsaturated moiety", is used herein to denote a species comprising at least one unsaturated carbon to carbon double bond in chemical proximity to at least one activating moiety. Preferably the activating moiety comprises any group which activates an ethyfenica!ly unsaturated double bond for addition thereon by a suitable eSectrophf!Sic group. Conveniently the activating moiety comprises oxy, thio, (optionally organo substituted Jaminc, thJocarbonyi and/or carbonyi groups (the latter two groups optionally substituted by thio, oxy or (optionally organo substituted) amino). More convenient activating moieties are (thio)ether, (thio)ester and/or (thio)amide moiet(ies). Most convenient "activated unsaturated moieties" comprise an "unsaturated ester moiety" which denotes an organo species comprising one or more "hydrocarbyiideniy thioJcarbony triJoJoxy" and/or one or more

"hydrocarby!ldeny1Ctriio)~carbQnyi(organo}am!no'' groups and/or analogous and/or derived moieties for example moieties comprising {meth)acryiate functionalities and/or derivatives thereof. "Unsaturated ester moieties" may optionally comprise optionally substituted generic α,β-unsaturated acids, esters and/or other derivatives thereof including thso derivatives and analogs thereof.

Acrylic and/or vinylic poiymer precursors (such as acrylic and/or vinySic oligomers or monomers) that are suitable for preparing acrylic and/or vinyl resins that may be used in the present invention, may comprise one or more hydrophobic, hydrophilic and/or partially hydrophilic poiymer precursors as components thereof that may be polymerized to form the acrylic and/or vinyl polymer.

The hydrophobic poiymer precursor may comprise, conveniently consist essentially of, at least one hydrophobic polymer precursor comprising at least one activated unsaturated moiety, conveniently at least one hydrophobic {meth)acrylate monomer, and/or aryiaikyiene polymer precursor. As used herein (methjacrylate denotes an acrylate and/or methacrylate moiety and similarly herein (meth)acry!ic denotes an acrylic and/or methacrylic moiety.

The hydrophobic (meth)acryiate may comprise €> hydrocarbo (meth}acrylate{s) and conveniently the C 4 hydrocarbo moiety may be C -30 hydrocarbyl, more

conveniently C4- 34 alky! most conveniently € -10 alkyl, for example C s alkyl.

Hydrophobic (meth)acryJate(s) may be seiected from; isooct l acryiate,

4~methy!-2~pentyi acrylate, 2-methylbutyl acryiate, isoamyS acrylate, sec-butyl acrylate, n-outyf acrylate, 2-ethyihexyl acrylate, isodecyl methacrylate, isononyl acrylate, ssodecyi acrylate, and/or mixtures thereof,

Aryiaikyiene monomers may comprises (optionally hydrocarbo substituted) stryene and the optional hydrocarbo may be G-io hydrocarbyi, more conveniently Ci-4 alkyl, Aryiaikyiene monomers are seiected from : styrene, a~methyi styrene, vinyl toluene, t-butyl styrene, di -methyl styrene and/or mixtures thereof.

Hydrophilic polymer precursors may be those that are co-polymerisibie with the hydrophobic poiymer precursor(s) and are water soluble. At least one hydrophobic polymer precursor may comprise at least one activated unsaturated moiety, Hydrophilic monomers comprise, advantageously consist essentially of, at least on ethylenically unsaturated carboxyiic acid (such as acids having one ethy!enlc group and one or two carboxy groups). Acid(s) may be selected from the group consisting of: acrylic acid (and oligomers thereof), beta carboxy ethyl acrylate, citraconic acid, crotonic acid, fumaric acid, itaconic acid, maleic acid, methacrylic acid and mixtures thereof.

Partially hydrophilic poiymer precursor(s) may also be referred to as partially water soluble monomers and conveniently may comprise at least one activated unsaturated moiety. Preferred partially hydrophilic monomers comprise, conveniently consist essentially of, at least one G -sa!kyi (meth)acryiate. More preferred partially hydrophilic monomers are selected from the group consisting of: methyl acrylate (MA), methyl methacrylate (MM A), ethyl acrylate (EA) and mixtures thereof.

An exampie of a suitabie ethyl acrylate (EA) resin are those resins available commercially from DuPont under the trade designation Bynel© 2000 series.

Ethyiene-vinyl acetate (EVA) resin, also known as poly (ethylene-vinyi acetate) (PEVA), denotes the ciass of copolymers formed from ethylene and vinyl acetate

monomers._Vinyi acetate (VA) has the structure

Ethyiene-acryi!c acid (EAA) resin denotes the class of copolymers formed from iic acid (AA) monomers, Acryiic Acid (AA) has the structure

Ethyiene-methacryl!c acid (EMA) resin denotes the class of copolymers formed from ethylene and methaerylic acid (MAA) monomers, Methacry!ic Acid (MAA) has the

structure

TypicaiSy, the total amount of the one or more acrylic resins and/or vinyl resins (such as EA, EAA, EVA and/or EMA resin(s)) in the heat seal composition of the heat seai layer is at least 15%, o at least 18%, or at least 20%, or at least 25%, or 30% acryiic and/or vinyl resin(s) by weight of the heat seal composition . Typically, at most 60%, or at most 55%, 50%, 45%, or 40% of acrylic and/or vinyl resin(s) wilt be present in the heat seai composition, ail weights of acryiic and/or vinyl resin based on the total weight of the respective heat sea! composition being 100% (depending of which composition the acryiic and/or vinyl resin(s) forms a part), EVA resins are the preferred vinyl resin, more preferably used in the previous stated amounts. The total amount of the acryiic and/or vinyl resin(s) present in the heat sea! composition may be from 15% to 60%, preferably from 18% to 55%, more preferably from 20% to 50%, even more preferably from 25% to 45%, most preferably from 30% to 40% or for exampie 18%, 23%, 30%, 34%, 36%, 54% or 60% by weight of the heat seai composition. Ail weights of the acrylic and/or vinyl resin(s) described herein are based on the total weight of the respective heat seal composition being 100%. It will be understood that if any acrylic and/or vinyl resin is also present as a component of the optional primer layer, the amounts of any such acrylic and/or vinyl resin primer layer components will be calculated separately and do not form part of the amounts described herein for acrylic and/or vinyl resins that may form part of the heat sea! layer,

Ethylene vinyl acetate (EVA) polymers useful for the invention contain vinyl acetate at from 15 to 50 wt%, or 18 to 40 wt%, or 25 to 40 wt%. Suc EVA resins are commercially available from DuPont under the trademark Elvax® {250, 420, 3180, 3185, 4031, 4260), Ceianese under the trademark Ateva© (2810A, 2821A, 3325AC, 4031AC), Arkema under the trademark Evatane® (28-05, 28-25, 28-40, 28-150, 33-25, 33-45, 40-55, 42-60).

The EVA resin may also be an EVA terpoiymer, These are terpolymers of ethylene, vinyl acetate, and acrylic or methacry!ic acid, Examples Include Elvax® 4260, 4310, and 4320,

Tackifiers

In order to provide a suitably low heat seal initiation temperature, as well as a relatively constant heat seal peel strength as a function of heat sea! temperature, the heat sea! compositions include a total amount of the one or more tackifier(s), in an amount of at least 20% by weight of the heat sea! composition or at !east 22%, 25%, 27%, or 30% of the tackifier(s} by total weight of the heat seal composition. The tackifier may be a tackifier resin. However, since tackifier(s) tend to be relatively expensive compared with the other components in the heat sea! composition and tend to generate coating blocking issues, there may be disadvantages to including more than 60% by weight of total tackifier in the heat seal composition for typical applications. Typical Sy the ^■ total amount of th tackifier{s) that will be present in the heat sea! composition will be, at most 60%, or at most 55%, 50%, or 45% of tackifier(s) by weight of the heat sea! composition. The total amount of the tackifier(s) present in the heat seal composition may be from 20% to 60%, preferably from 22% to 60%, more preferably from 25% to 55%, even more preferably from 27% to 50%, most preferably from 30% to 45%, or for example 6%, 18%, 24%, 25%, 30% or 60% by weight of the heat sea! composition. All weights of the tackifier(s} described herein are based on the total weight of the heat seal composition being 100%,

Tackifier(s) (which may comprise tackifier resin(s)) suitable for the invention include, but are not limited to, synthetic and natural polyterpenes, hydrocarbon resins, rosin and rosin ester resins, and combinations thereof. The tackifier resins may have ring and bail softening points from 20°C to 160°C, preferably 90°C to i25°C. The number average molecular weights of the tackifier resins are typically at least 200 or 500, and typically at most 5000, 2000, or 1000 daitons and thus typically may have a M _ri from 200 to 5000, preferably SOO to 1000 daitons, more preferably 500 to 1000 daitons.

Natural polyterpene tackifier resins are based on natural and renewable feedstocks, Including alpha-pinene, beta-pinene and d-limonene. Examples include:

1) Piccolyte® C resin (C85, C105, C115, C125, C135), Piccolyte® F resin (FIGS, F115), Piccolyte® A resin (A25, A115, A125, A135), Piccolyte® S resin (525, 585, 5115, 5125, 5135); all available from Pi nova.

2) Sylvares® TR resin (A25L, 90, 105, 7115, 7125); all available from Arizona Chemical,

Hydrocarbon tackifier resins are made from petroleum based feedstocks, either aliphatic (C5), aromatic (C9), DCPD (dicyciopentadiene), or mixtures of these,

Examples include:

1) Piccotac™ 1020, 1095, 1100, 1115, 6095-E, 8095; Picco™ 5120, 5140, 6100, 2215; Regaiite™ 51100, 7125; Regaiite™ RIQIG, 1100, 9100,

Regalrez™ 1018, 1094, 3102, 6108; all available from Eastman;

2) Quintone® A1G0, B170, K100, MiOO, N295, U19G, 5100, D100, U185; ail available from Nippon Zeon of Japan;

3) Escorez™ 1102, 1304, 1315, 2203, 5300, 5320, 5340, 5400, 5415, 5600, 5615, 5690; all available from ExxonMobil ;

4) Wingtack® 86, 95, 98; Norsotene® W85, 90, 100, 110, 120, 130, 140; ail available from Cray Valley,

Rosin ester tackifier resins are produced by the reaction between rosin acids and alconois, The rosin acids may be modified by hydrogenation or disproportlonation, The typical commercial products are methyl, trsethylene glycol, glycerol, and pentaerythrito! esters. Examples include:

1) Fora!® 85, 105; 3085; Pentalyn® A, H, Pentalyn® 9085, 9100;

Staybeiite<® Ester 3, 5, 10; all available from Pi nova;

2) Syivali e™ RE80HP, RE85GB, RE10OXL, RE100L, 105L, 110L, RE25, 85,

98; all available from Arizona Chemical;

3) Foralyn™ 90, 110, 50201; Permaiyn ^,M 2085, 5095, 3100, 5110, 6110; all available from Eastman,

Poiyolefin piastomer (POP) resin

Typically, the heat seai compositions include at least 10% in total of one or more poiyolefin piastomer (POP) resin(s) by weight, or at least 15% or 20% by weight of the POP resin{s) by weight of heat seal composition. Typically, at most 60%, or at most 50%, 40%, or 30t% by weight of POP resin(s) will be present by weight of the heal seal composition. The total amount of the POP resin(s) present in the heat seal composition may be from 10% to 60%, preferably from 10% to 50%, more preferably from 15% to 40%, most preferably from 20% to 30 by weight of the heat seai composition. All weights of the POP resin(s) described herein are based on the totai weight of the heat seal composition being 100%,

Poiyolefin piastomer (POP) resins are polymers that combine the qualities of elastomers and plastics, provsding rubber-like properties with the processing ability of a thermoplastic, POP resins suitable for use in the invention comprise ethylene and at least one C3-C20 o(alpha)-olefin _f preferably a C -Cs o(aipha)-olefin, polymerized using a metaSiocene catalyst. Examples of such resins, and methods of making them, are disclosed in US 4542199, US4752597, US4SQ8561, US5189192 and US5349I00 ail of which are incorporated herein by reference for all purposes. Suitable plastomers are commercially available under the trademarks Affinity™, Versify™ and Engage™ (Dow Chemicals), Queo™* (Borealis), Exact™ and V sta axx™ {ExxonMobil).

POP resins used in the present invention are obtained or obtainable from at ieast one monomer of Formula 1

CHs=CHR Formula 1

where is H or Cj-io alky! (and preferably Formula 1 representing an ethylene monomer) together with at !east one other, different, poiymer precursor selected from any of I to V:

I, at ieast one different polymer precursor also represented by Formula 1 II. at ieast one polymer precursor represented by Formula 2

C4-20 a (alpha), ω (omega) - dioiefins; - Formula 2

ΠΙ. at least one polymer precursor represented by Formula 3

C3-20 0 (alpha)™ olefins; ~ Formula 3

IV. at ieast one polymer precursor represented by Formula 4

C S dioiefins; - Formuia 4 and

V. at ieast one poiymer precursor represented by Formuia 5

G¾-is cyclic oiefins (including norborene) - Formuia 5,

Usefuiiy POP resins for use in the present invention may be copoiymer(s) of at ieast one C2--4 aikyiene and at ieast one poiymer percusor of any of Formulae 2 to 5.

Preferred POP resins are copolYmer(s) of ethylene and/or propylene at least one

C5-20 hydrocarbyiene, more preferabiy are copolymer(s) of ethylene and at least one Ce- js aikyiene, even more preferabiy are copoi mer(s) of ethylene and at ieast one Ce 12 aikyiene, most preferabiy are copoiymer(s) of ethylene and at Ieast one linear monounsaturated Ce- io aikyiene, for example is a copolymer of ethylene and i-octene.

Conveniently POP resins for use in the present invention are prepared using a suitable catalyst, more conveniently being other than a Zieg!er-Natta catalyst or a free radical initiators, most conveniently the catalyst being selected from the grou consisting of: metai!ocenes (such as complexes with zrconium, hafnium and/or vanadium) , alumoxane, anionic, nonionic ligand systems with group 4 to 8 metals and/or chirai organo metallic complexes.

The polyolefin plastomer resins used in the present the invention may combine qualities of elastomers and plastics, for example by exhibiting rubber-like properties with the processing ability of plastic. Current commercially available POP resins are copolymers of ethylene and other olefins typically made with meta!locene catalysts. In contrast typical low density olefin polymers (such as linear Sow density polyethylene (LLDPE); low density polyethylene (LDPE) and very linear low density polyethylene (VLDPE)) are manufactured by conventional Zlegler-Natta catalysts or free radical initiators. Without wishing to be bound by any theory the applicant believes that as POP resins may comprise high amounts of other olefin units, have a very low melting point and reduced crystaliinity yet still exhibit a relatively high molecular weight, POP resins may be particularly suited to the requirements of a heat sealable coating.

The molecular weight of a polymer or oligomer as described herein, for example weight average molecula weight (also denoted as M«) or number average molecular weight (also denoted as Mrs) may be calculated by theory and/or measured by any suitable conventional methods, for example by Gel Permeation Chromatography (GPC); Gas Chromatography Mass Spectrometry (GC-MS) and/or by Size Exclusion

Chromatography (SEC) as known to those skilled in the art, GPC method is preferred using a polystyrene standard-

The weight average molecular weights (Mw) of the POP pfastomers for use in the invention are typically at least 3, or at least 5, or at least 12, or at least 15 and at most 60, or at most 50 or at most 40 or at most 30 kiiodaltons, M« preferably determined by GPC using a polystyrene standard. Usefully the POP plastomers have a of from 3 to 60 kiiodaltons, or from 5 to 50 kiiodaltons, or from 12 to 40 kiiodaltons or from 15 to 30 kiiodaltons.

The number average molecular weights (Mr,) of the POP plastomers for use in the Invention are typically at least 5, or at least 15 and at most 50, or at most 30 kiiodaltons, Mt¾ preferably determined by GPC using a polystyrene standard. Usefully the POP plastomers have a M _n of from 5 to 50 kiiodaltons or from 15 to 30 kiiodaltons.

The amount of a(aipha) -olefin comonomer in the plastome is from 5 to 85 mol%, preferably from 10 to 25 mol%, more preferably from 10 to 30 mol%. The DSC melting point of the plastomer is typically beiovv 100°C, or at most 70°C. It is typically at least 40°C, or at least 45°C or 50°C. The tensile strength of the plastomer is generally from 1.0 to 20 MPa, preferably from 5 to 10 MPa [20 in / min (~50.8 cm / min.},, ASTM D369],

Typically, POP resins suitable for use according to the invention are soluble to at least a 10% solids level in at leas one of toluene, xylene, dichlorobenzene, trichlorobensene or a mixture of any of these with THF or ethyl acetate, in each case at δ5°0< Typically, the resulting solutions are clear.

Other ingredients

Sli additives are used to reduce th resistance of composite film to sliding over itself or parts of converting equipment. The most common slip additives in coating industry are long -chain, fatty a id amides, such as erucamide and oieamide.

One or more slip agents, for example calcium stearate or fatty acid amides (for example Kemamide® EZ and Kemamide® OR, available from Chemtura) is/are typicaiiy included in the heat seal composition. If included, the siip agent(s) in totai will typicaiiy constitute at ieast 0.15% by weight of the heat seal composition, or at least 0.2%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, or 3.5% by weight of the heat seal composition.

The slip agent(s) in total will typically constitute at most 7 wt% of the composition, or at most 6.5%, 6%, 5-5%, 5%, or 4.5% of the heat sea! composition. The total amount of the slip agent(s) present in the heat seal composition may be from 0.15% to 7%, preferably from 0.2% to 6.5%, more preferably from 0.5% to 6.5%, even more preferably from 1% to 6.5%, most preferably from 1,5% to 6,5% or from 2% to 6% or from 2,5% to 5,5% or from 3% to 5% or from 3.5% to 4.5%, or for exampie 1.5%, 1.7% or 2.5% by weight of the heat seal composition. Ail weights of the slip agent(s) described herein are based on the total weight of the heat seal composition being 100%.

Optional ingredients for the heat seal layer may, among others, include one or more of the following; anti-block additives and/or matting agents, e.g., silica such as Syloid 244 or SySoid 620, available from Grace Davison (optionally present in an amount of from 1% to 3%, preferably 1.5% to 2.5%, for example 1.5%; 2,2% or 2.5% by weight of the heat seal composition) anti-fog agents, e.g., sorbitan esters such as ATMER™ 100, available from Croda Polymer Additives; anti-static agents, e.g., glycerol esters such as Atmer™ 129, available from Croda Polymer Additives; UV absorbers, e.g., Tinuvin® 477 DW and Tinuvin® 1130, available from Ciba; and pigments, e.g., titanium dioxide such as Ti-Pure™ R-iOi, available from Chemours.

The heat seal composition forms the heat seal layer of the composite films of the invention so the same weight % of acrylic ressn(s), vinyl ressn(s), POP resin(s) tackifier(s), slip agent(s) and/or any other components thereof given herein in the heat seal composition also correspond to the total weight of those component(s) by weight that may be present in the heat seal layer where the total weight of the heat sea! layer is 100%. Polymer film

Trie polymer film used in the present invention, prior to deposition of arty coating or layer may be any suitable polymer than that is capable of forming a film and may thus comprise; poiyoiefins [e.g. polypropylene (PP) and/or polyethylene (PE)] poiyurethanes, poiyvinyihaiides [e.g. polyvinylchioride (PVC)3, polar polymers,, poiyesters [e.g. poiyethyien terephtha!ate (PET)] or other polyesters as described herein, polyamides [e.g, nylons], poiyaryletherketones, and/or non-hydrocarbon polymers); suitable combinations and/or mixtures thereof.

Preferably the polymer film comprises a homopolymer, a crystalline polymer and/or a polymer of randomly oriented amorphous non-crystalline poiyrner chains.

Conveniently the polyoiefin films to be used as the polymer film in the present invention may comprise one or more poiyoiefins [e.g. polypropylene homopolymer, polyethylene homopolymer [e.g, linear low-densit polyethylene (LL0PE)] and/or polypropylene / polyethylene copolymer(s); optionally in one or more layers]. The constituent polymers and/or layers in a polymer film of the present invention may be oriented, blown, shrunk, stretched, cast, extruded, co-extruded and/or comprise any suitable mixtures and/or combinations thereof. The polymer film may optionally be cross!inked by any suitable means such as electron beam (EB) or UV crosslink ng, if necessary by use of suitable additives in the polymer film.

The definition of polyoiefin, as intended herein, is a polymer assembled from a significant percentage, preferably >50% by weight of one or more olefin monomers. A copolymer is a polymer assembled from two or more monomers. Polyoiefin films may include, but are not limited to, polyethylene homopoiymers, ethylene-a-olefin copolymers, poiypropylene-a-oiefln copolymers; polypropylene homopolymers, ethylene-vinyl acetate copolymers, ethyiene-methacry!ic acid copolymers and their salts, ethylene-styrene polymers and/or blends of such polymers.

Polymeric resins used to produce the polymer films of th present invention are generally commercially available in pellet form and may be melt blended or

mechanically mixed by well-known methods known in the art, using commercially available equipment including tumblers, mixers and/or blenders. The resins may have other additional resins blended therewith along with well-known additives such as processing aids and/or colorants- Methods for producing polymer films are well-known and include the techniques of casting films as thin sheets through narrow siit dies, and blown-film techniques wherein an extruded tube of molten polymer is inflated to the desired bubble diameter and/or film thickness. For example to produce a polymer film the resins and additives may be introduced into an extruder where the resins are melt p!astified by heating and then transferred to an extrusion die for formation into a film tube. Extrusion and die temperatures wiil generally depend upon the particular resin being processed and suitable temperature ranges are generally known in the art or provided in technical bulletins made available by resin manufacturers. Processing temperatures may vary depending upon process parameters chosen.

The poiymer fiim of the present invention may be unoriented (cast fiim), may preferabiy orientated in at ieast one direction (monoaxialiy orientated), more preferably orientated in two directions (biaxiaiiy orientated).

Orientation of the polymer film of the present invention may be achieved by stretching the polymer film at a temperature above the glass transition temperature (Tg) of its constituent polymers). The resultant oriented poiymer fiim may exhibit greatly improved tensile and stiffness properties. Orientation may be along one axis if the poiymer fiim is stretched in only one direction, or may be biaxial if the polymer film is stretched in each of two mutually perpendicular directions in the plane of the film, A biaxial oriented poiymer fiim may be balanced or unbalanced, where an unbalanced film has a higher degree of orientation in a preferred direction, usually the transverse direction, Conventionally the longitudinal direction (LD) is the direction in which the fiim passes through the machine (aiso known as the machine direction or MD) and the transverse direction (TD) is perpendicular to MD, Preferred polymer fi!ms are oriented in both MD and TD, Orientation of the poiymer fiim may be achieved by any suitable technique. For exampie a flat poiymer fiim may be oriented by simultaneous or sequential stretching in each of two mutually perpendicular directions by means of a stenter, or by a combination of draw rolls and a stenter. In a bubbie process a polymer fiim is extruded in the form of a composite tube which is subsequently quenched, reheated, and then expanded by internal gas pressure to oriented in the TD, and withdrawn, at a rate greater than that at. which it is extruded, to stretch and orient it in the MD.

The poiymer film of the composite film is self-supporting, and it is preferred to be a biaxiaiiy oriented fiim optionally a poiar poiymer or a poiyolefin. The polymer film may optionally contain slip additives and/or anti-block additives.

As used herein the term ^¾ po!ar polymer" denotes a poiymer which is obtained and/or obtainable from at Ieast one poiymer precursor which itself comprises polar moiet(ies) and/or where the polymer comprises a repeat unit comprising polar moest(ies). One example of such a polar moeity is a carbonyioxy moiety. The term poiar poiymer does not therefore necessarily imply any common properties in the resultant poiymer or in films made therefrom. Usefully the polar polymers comprise polyester polymers and/or poiyaryietherketone polymers.

Examples of poiar polymers comprise polyarySetherketones; polyesters that comprise polyethylene terephthaiate (PET), polylactate (PLA), poly hydroxybuty rate (PHS), poiyfuranoate (PEP) and/or polyethylene naptha!ate (PEN); copo!yesters comprising or consisting of repeat units for any of th foregoing (or any other polyesters described herein) such as: terephthaiic acid, lactic acid, hydroxy butyric acid, furanoic acid, napthaiic acid and/or aliphatic dicarboxylic acids and diols; for example copoiyesters of terephthaiic acid, napthaiic acid and/or aliphatic dicarboxylic acids and dioi. Further examples of suitable polar polymers are described herein. Polyesters are particularly preferred to form the self supporting layer of the polymer film described herein.

The polymer fiim may have shrinkage of less than 5% in length and/or width upon exposure to boiling water for five seconds. The polymer Film may be a single layer of a polymer having no other layer comprising any polymer (same or different), or no layer of metal, on a surface opposite the one bearing the primer and the heat seal composition.

Poiyolefins suitable for forming the self-supporting layer of polymer film used in the present invention may include any of the poiyolefins described herein which are capable of being formed into a film (fiimabie) alone (i.e. as a substantially pure polymer) and/or in a mixture and/or copolymer with other polymers (such as any described herein). Preferred polyolefin films are polypropylene (PP) and/or polyethylene (PE), biaxialiy orientated polypropylene (BOPP) film being more preferred.

Poiyesters suitable for forming the self-supporting layer of polymer film used in the present invention may include any of the following which are capable of being formed Into a fiim alone and/or in a mixture and/or copolymer with other polymers (such as any other polymers, e.g. poiyesters, described herein).

Aliphatic polyester homopolymers such as poiygiycoiide or polygiycolic acid (PGA), poiyiactic acid (PLA), poSycaproSactone (PCI), polyhydroxyaikanoate (PHA) and/or poiyhydroxybutyrate (PHB).

Aliphatic polyester copolymers such as polyethylene adipate (PEA), poiybuty!ene succinate (PBS) and/or poiyi3-hydroxybutyrate-co~3-hydroxyvaierate) (PHBV).

Semi-aromatic polyester copolymers such as polyethylene terephthaiate (PET), po!ybutylene terephthaiate (PBT), poiytrimethyiene terephthaiate (PTT), polyethylene naphthaiate (PEN) and/or polyethylene furanoafce (PEF).

Aromatic polyester copolymers such as the polymer obtained and/or obtainable by polycondensation of 4-hydroxybenzoic acid and 6-hydroxYnaphthalene-2~carboxySic acid and available commercially from Kuraray under the tradename Vectran™.

Also suitable for use in the present invention are fiimabie polar polymers such as polyaryietherketones (PAEK), e.g. polyether ether ketone (PEEK) available commercially from Victrex Pic under the registered trademark Vsctrex®.

Poiyesters and/or poiyaryletherketones suitable for use as the polar polymer film in the present invention may comprise at least one polymer selected from the group consisting of: aliphatic polyester homopoiymers (such as PGA, PLA, PCL, PHA and/or PHB); aliphatic polyester copolymers (such as PEA, PBS and/or PHBV);

■semi-aromatic polyester copolymers (suc ET, PBT, PIT, PEN and/or PEF); aromatic poiyester copolymers (such as Vectran™), PEEK poiymers (such as those available commercially unde the registered trademark Victrex®), any suitable mixtures, combinations and copolymers thereof.

Preferred polymers suitable for use as the polar polymer film in the present invention comprise at least one polymer selected from the group consisting of: PGA, PLA, PCL, PHA, PHB, PEA, PBS, PHBV, PET, PBT, PIT, PEN, PEP, Vectran®, PEEK and/or any suitable mixtures, combinations and copolymers thereof .

More preferred polyesters suitable fo use as a polymer film in the present invention comprise at least one polyester selected from the group consisting of: PLA, PHB, PET, PEN, PEF, any suitable mixtures, combinations and copolymers thereof.

Even more preferred polyesters suitable for use as the polymer film in the present invention comprise at least one polymer selected from the group consisting of: PET, PEN and PEF,

Most preferred polyesters suitable for use as the polymer film in the present invention comprise at least one polymer selected from the group consisting of: PET and PEN.

For example polyesters suitable fo use as the poiymer fiim in the present invention comprise at least one PET poiymer.

Primer layer

The optional primer layer where present may comprise a halo poiyvinyiidfne polymer, (such as a PVdX poiymer where X is halo), preferably a poiyvinylidene chloride polymer (e.g. where X is chloro, i.e. PVdC) and/or an acrylic poiymer and/or a vinyl polymer (preferably an EVA poiymer). Useful acryiic and/or vinyi poiymer(s) for inclusion in the primer layer are those described herein for inclusion in the heat seal layer such that the heat seal layer sufficiently adheres to the primer iayer to resist delamination, Ethyiene-acrylic acid (EAA) and/or ethylene-methacryiic acid (EMA) primers may also be used. Alternatively the primer iayer may be absent if the self-supporting layer of the polymer film is a corona treated polyo!efin fiim, the surface of which has thus been activated sufficiently such that the heat seaiab!e composition may be applied directly to the unp fmed poiyoiefin fiim and adhere strongly thereto,

A primer composition may be applied to the self-supporting iayer of the polymer film used to prepare the composite films of the invention, the primer composition comprising suitable amounts of halo poiyvinylidene, acrylic resin(s) and/or vinyi resin(s) therein. Thus the optionai primer layer may also comprise any halo polyvsnyiidene poiymer, acrylic resin and/or vinyi resin in any suitable mixtures thereof in any suitable ratios or amounts,

The total amounts of acrylic and/or vinyl resin that may be present in the primer iayer may be in the same amounts given herein for the acrylic and/or vinyl resin present in the heat sea! layer, the remainder of the primer layer being the PVdX component. Preferably the primer Iayer comprises, more preferably consists of halo poSyvlny!idene polymer (e.g. PVdC poiymer), acrylic resin and/or vinyl resin (e.g.

EVA), even more preferably is PVdC and/or EVA, most preferably is PVdC.

Where the primer composition comprises acrylic resln(s) and/or vinyl resin(s) although the amounts (expressed as a weight percentage based on the total weight of the primer composition or layer being 100%) of these components may correspond to the total weight of acryiic resin(s) and/or vinyl resin(s) by weight given herein for the amounts presen in the heat sealing composition or layer, ft will be appreciated that the amounts of acrylic resin(s) and/or vinyl resin(s) that may be present in each of the primer layer and/or heat seal layer is calculated separately and independently.

Qatma^heat.sealma..an ,7Qr.anmer)..CQmpQsiti^n.and.m hoc

The above components may be applied to a poiymer film such as a polyester substrate from a solution in an organic solvent or mixture thereof. Any conventional coating method, such as spray coating, roll coating, slot coating, meniscus coating, immersion coating, wire-bar coating, air knife coating, curtain coating, doctor knife coating, direct and reverse gravure coating, and the like, may be used to apply the coating composition. The coating is then dried,

A yet other aspect of the invention provides a packaging article which is a cap for a packaging article lined with a composite film of the invention as described herein.

A still yet other aspect of the invention provides a filled packaging article sealed with a cap of the invention as described herein

A stiii yet another aspect of the Invention provides a method of filling a packing article with a food stuff or human and/or animal consumable liquid comprising the steps of:

a) filling the article wit the foodstuff or human and/or anima! consumable liquid;

b) applying to the filled article the cap of the invention to reversibiy seal the article.

Unless the context clearly indicates otherwise, as used herei plural forms of the terms herein are to be construed as including the singular form and vice versa.

The term "comprising" as used herein will be understood to mean that the list following is non exhaustive and may or may not include any other additionai suitable stems, for example one or more further feature(s), component(s),. Sogredient(s) and/or substituent(s) as appropriate.

The terms "consisting'', "consisting of" and/or "is ^* " as used herein wits be understood to mean that the following list is substantially exhaustive so generally comprises the listed component(s) as the major component(s) thereof, and may for example thus exclude other additional items,

"Major component" (or synonyms thereof) as used herein will be understand to mean an proportion where any additional elements or additives present have no substantia! effect on the properties of the component and thus the major component may be present in an amount of at Seast 50%, preferably at least 60%, more preferably at Seast 70%, most preferably at least 80%, especially at Seast 90%, most especially about 99% parts of the relevant whole.

The terms "effective", "acceptable" "active" and/or "suitable" (for example with reference to any process, use, method, application, preparation, product, material, formulation, compound, monomer, oligomer, polymer precursor, and/or polymers of the present invention and/or described herein as appropriate) will be understood to refer to those features of and/or used on the invention which if used in the correct mariner provide the required properties to that which they are added and/or incorporated to be of utility as described herein. Such utility may be direct for example where a material has the required properties for the aforementioned uses and/or indirect for example where a material has use as a synthetic intermediat and/or diagnostic tool In preparing other materials of direct utility. As used herein these terms als denote that a functional group Is compatible with producing effective, acceptable, active and/or suitable end products.

Preferred utility of the present invention comprises one or more of uses of a film as a heat sealabie component (such as a lid) of a packaging articie such as an ovenable tray for food and/or as a liner for a cap for a packaging article.

In the discussion of the invention herein, unless stated to the contrary, the disclosure of alternative values for the upper and Sower iimit of the permitted range of a parameter coupled with an indicated that one of said values is more preferred than the other, is to be construed as an implied statement that each intermediate value of said parameter, lying between the more preferred and less preferred of said

alternatives is itself preferred to said less preferred value and also to each less preferred value and said intermediate value.

For all upper and/or Sower boundaries of any parameters given herein, the boundary value is included in the value for each parameter. It w!li aSso be understood that all combinations of preferred and/or intermediate minimum and maximum boundary values of the parameters described herein in various embodiments of the invention may also be used to define alternative ranges for each parameter for various other embodiments and/or preferences of the invention whether or not the combination of such values has been specifically disclosed herein.

Thus for example a substance stated as present herein in an amount from 0 to "x" (e.g. in units of mass and/or weight %) is meant (uniess the context clearly indicates otherwise) to encompass both of two alternatives, firstiy a broader alternative that the substance may optionally not be present (when the amount is zero) or present oniy in an de-minimus amount be!ow that can be detected. A second preferred aiternative (denoted by a iower amount of zero in a range for amount of substance) indicates that the substance is present, and zero indicates that the lower amount is a very small trace amount for example any amount sufficient to be detected by suitable conventional analytical techniques and more preferably zero denotes that the lower limit of amount of substance is greater than or equal to 0.001 by weight % (calculated as described herein).

It will be understood that the total sum of any quantities expressed herein as percentages cannot (allowing for rounding errors) exceed 100%. For example the sum of aii components of which the composition of the invention (or part(s) thereof) comprises may, when expressed as a weight (or other) percentage of the composition (or the same part(s) thereof), total 100% a!iowing for rounding errors. However where a list of components is non exhaustive the sum of the percentage for each of such components may be less than 100% to allow a certain percentage for additional amount(s) of any additional component(s) that may not be explicitly described herein.

The term "substantially" as used herein may refer to a quantity or entity to imply a large amount or proportion thereof. Where It is relevant in the context in which it is used "substantially ¹ ' can be understood to mean quantitatively (in relation to whatever quantity or entity to which It refers in the context of the description) there comprises an proportion of at least 80%, preferably at least 85%, more preferably at least 90%, most preferably at least 95%, especially at least 98%, for example about 100% of the relevant whole. By analogy the term "substantially-free" ^" may similarly denote that quantity or entity to which it refers comprises no more than 20%, preferably no more than 15%, more preferably no more than 10%, most preferably no more than 5%, especially no more tha 2%, for example about 0% of the relevant whole.

The terms "optional substituent" and/or "optionally substituted" as used herein (unless followed by a list of other substituents) signifies the one or more of following groups (or substitution by these groups): carboxy, suipfto, formy!, hydroxy, halo amino, imino, nitri!o, mercapto, cyano, nitro, methyl, methoxy and/or combinations thereof. These optional groups include all chemically possible combinations in the same moiety of a plurality (preferably two) of the aforementioned groups (e.g. amino and sulphonyl if directly attached to each other represent a suiphamoyl group), Preferred optional substituents comprise: carboxy, sulpho, hydroxy, amino, mereapto, cyano, methyl, chioro, fluro , trihaiomethyi and/or methoxy,

The synonymous terms organic substituent" and "organic group" as used herein (aiso abbreviated herein to "organo") denote any univalent or multivalent moiety (optionally attached to one or more other moieties) which comprises one or more carbon atoms and optionally one or more other heteroatoms. Organic groups may comprise organoheteryi groups (als known as organoeSement groups) which comprise univalent groups containing carbon, which are thus organic, but which have their free vaience at an atom other than carbon (for example organothio groups). Organic groups may alternatively or additionally comprise organy! groups which comprise any organic substituent group, regardless of functional type, having one free vaience at a carbon atom. Organic groups may aiso comprise heterocyclyl groups which comprise univalent groups formed by removing a hydrogen atom from any ring atom of a heterocyclic compound: (a cyclic compound having as ring members atoms of at least two different elements, in this case one being carbon). Preferably the non carbon atoms in an organi group may be selected from; hydrogen, halo, phosphorus, nitrogen, oxygen, silicon and/or suiphur, more preferably from hydrogen, nitrogen, oxygen, phosphorus and/or sulphur.

Most preferred organic groups comprise one or more of the following carbon containing moieties: a!kyl, aikoxy, alkanoyi, carboxy, earbonyl, formyi and/or combinations thereof ; optionaiiy in combination with one or more of the following heteroatom containing moieties: oxy, thlo, sulphonyl, sulphonyl, amino, imino, nitrtlo and/or combinations thereof. Organic groups include ail chemically possible

combinations in the same moiety of a plurality (preferably two) of the aforementioned carbon containing and/or heteroatom moieties (e.g. aikoxy and carbonyi if directly attached to each other represent an alkoxycarbonyl group).

The term "hydrocarbo group" as used herein is a sub set of an organic grou and denotes any univalent or multivalent moiety (optionaiiy attached to one or more other moieties) which consists of one or more hydrogen atoms and one or more carbon atoms and may comprise one or more saturated, unsaturated and/or aromatic moieties. Hydrocarbo groups may comprise one or more of the following groups.

HydrocarbyS groups comprise univalent groups formed by removing a hydrogen atom from a hydrocarbon (for example aiky!), Hydrocarbylene groups comprise divalent groups formed by removing two hydrogen atoms from a hydrocarbon, the free valencies of which are not engaged in a double bond (for example alkylene).

Hydrocarbylidene groups comprise divalent groups (which may be represented by " 2C=") formed by removing two hydrogen atoms from the same carbon atom of a hydrocarbon, the free valencies of which are engaged in a double bond (for example alkylfdene). Hydrocarbylidyne groups comprise trivaient groups (which may be represented by ^¾ C≡*}, formed by removing three hydrogen atoms from the sam carbon atom of a hydrocarbon the free valencies of which are engaged in a triple bond (for example aikyiidyne). Hydrocarbo groups may also comprise saturated carbon to carbon single bonds (e.g. in alky! groups); unsaturated double and/or triple carbon to carbon bonds (e.g. in respectively a!keny! and aikynyi groups); aromatic groups (e.g. in aryi groups) and/or combinations thereof within the same moiety and where indicated may be substituted with other functional groups

The term "aikyi" o its equivalent (e.g. "alk") as used herein ma be readily replaced, where appropriate and unless the context clearly indicates otherwise, by terms encompassing any other hydrocarbo group such as those described herein (e.g. comprising double bonds, triple bonds, aromatic moieties (such as respectively aSkenyl, aikynyi and/or aryi) and/or combinations thereof (e.g. araikyl) as well as any multivalent hydrocarbo species linking two or more moieties (such as bivalent

hydrocarbylene radicals e.g. aikylene).

Any radical, substituent, group or moiety mentioned herein may be a multivalent or a monovalent species but Is preferably monovalent species unless otherwise stated or the context clearly indicates otherwise (e.g. a bivalent hydrocarbylene moiety linking two other moieties (such as an aikylene moiety). However where indicated herein such monovalent or multivalent species may still also comprise optional subststuents, A group which comprises a chain of three or more atoms signifies a group in which the chain wholly or in part may be linear, branched and/or form a ring (including spiro and/or ^' fused rings), The total number of certain atoms is specified for certain substituents for example Ci-MOrgano, signifies an organo moiety comprising from i to H carbon atoms. In any of the formulae herein if one or more substituents are not indicated as attached to any particular atom In a moiety (e.g. on a particular position along a chain and/or ring) the substituent may replace any H and/or may be located at any available position on the moiety which is chemically suitable and/or effective.

Preferably any of the organo groups listed herein comprise from 1 to 36 carbon atoms, more preferabiy from i to 18. It is eve mor preferred that the number of carbon atoms in an organo group Is from i to 12, most preferred from 1 to iO, even most preferred from i to 6, for example from 1 to 4 carbon atoms.

As used herein chemical terms (other than lUAPC names for specifically identified compounds) which comprise features which are given in parentheses - such as (alkyS)acrySate _f (meth)acrylate and/or (co)polymer ~ denote that that part in parentheses is optional as the context dictates, so for example the term (meth)acrylate denotes both methacrylate and aery late.

The substituents on the repeating unit of a polymer and/or oligomer may be selected to ^' improve the compatibility of the materials with the polymers and/or resins in which they may be formulated and/or incorporated for the uses described herein, Thus the size and iength of the substituents may be selected to optimise the physical entangiement or interiocation with the resin or they may or may not comprise other reactive entities capabie of chemicaiiy reacting and/or cross-Sinking with such other resins as appropriate,

Certain moieties, species, groups, repeat units, compounds, oligomers, polymers, materials, mixtures, compositions and/or formulations which comprise and/or are used in some or ail of the invention as described herein may exist as one or more different forms (such as isomeric and/or physical forms) which comprise any of those in the following non exhaustive list:

stereoisomers (such as enantiomers (e.g. £ and/or Z forms), diastereoisomers and/or geometric isomers); tautorners (e.g. keto and/or enol forms), conformers, salts, zwitterions, complexes (such as chelates, clathrates, crown compounds, cyptands / cryptades, inclusion compounds, intercalation compounds, interstitial compounds, iigand complexes, organometalilc complexes, non-stoichiometric complexes, n -ad ducts, solvates and/or hydrates); isotopicai!y substituted forms, polymeric configurations [such as homo or copolymers, random, graft and/or block polymers, linear and/or branched polymers (e.g. star and/or side branched), hyperbranched polymers (such as those of the type described in WO 93/17060), cross-linked and/or networked polymers, polymers obtainable from di and/or tri-vaSent repeat units, dendritic macromo!ecules (such as dendrimers), polymers of different tacticity (e.g. isotactic, syndlotacti or atactic polymers)] ; polymorphs (such as interstitial forms, crystalline forms and/o amorphous forms), different phases, solid solutions; and/or combinations thereof and/or mixtures thereof where possible. The present invention comprises and/or uses ail such forms which are effective (e.g. as defined herein).

Other conventional terms from polymer science that are used herein (such as polymer, monomer, oligomer etc) shall have those meanings recommended by lUPAC and as defined in Pure Appl, Chern,, Vol. 68, No.12, pp. 2287-2311, 1996, the contents of which are incorporated herein by reference. The terms "resin" and "polymer" are, unless the context clearly indicates otherwise, used herein Interchangeably so for example the terms acrylic resin and vinyl resin also denote acrylic polymer and vinyl polymer respectively and vice versa.

The formuSa(e) herein may represent a polymeric mixture or a series of discrete compounds. If the formuia(e) herein represent species which are morsodisperse (such as compounds) then the values of any numerical variables denoted therein {such as V and the like, for example denoting the number of repeat units) are independently an integer (or zero if the context allows) within the specified range. If the formula represents the average structure of many discrete species present in a poSydisperse oligomeric and/or polymeric mixture then the numerical values of any variables shown in the formula may b real, non-integer, numbers with the specified ranges.

It is appreciated that certain features of the invention, which are for clarity described In the context of separate embodiments may also be provided in combination in a single embodiment. Converseiy various features of th invention, which are for brevity, described in the context of a single embodiment, may also be provided separateiy or in any suitable sub-combination, Many other variations embodiments of the invention will be apparent to those skilled in the art and such variations are contemplated within the broad scope of the present invention.

Further aspects of the invention and preferred features thereof are given in the claims herein.

Examples

The present invention will now be described in detail with reference to the following non limiting examples provided to further illustrate the processes and compositions of the present Invention, These examples are illustrative only and are not intended to limit the scope of the invention in any way. Unless otherwise specified all parts, percentages, and ratios are on a weight basis. The prefix C or COMP before an example indicates that it is comparative and does not form part of the invention,

Various registered trademarks, other designations and/or abbreviations are used herein to denote some of ingredients used; to prepare polymers and compositions of the invention, These are identified below by chemical name and/or trad nam and optionally their manufacturer or supplier from whom they are available commercially. However where a chemicai name and/or supplier of a material described herein is not given it may easily be found for example in reference literature well known to those skilled in the art, Unless otherwise indicated, all compositional percentages and ratios recited herein are on a weight basis and all coating weights refer to dried coating weights. The following ingredients are referred to in the Examples discussed further below.

Affinity™ GA 1950 polymer is an ethylene-octene polyoSefi elastomer available from Dow, produced by metai!ocene-cataiyzed polymerization,

ESvax® 3180 resin is an EVA containing 28% vinyl acetate and 72% ethylene units, available from DuPont

Eivax-®' 3185 resin is an EVA containing 32% vinyl acetate and 68% ethylene units, available from DuPont. Eiva ^ 4260 ressn is an EVA containing 28% vinyl acetate, 71% ethylene and about 1% methacryiic acid units, available from DuPont,

Engage™ 8200 polyoiefin elastomer is an ethyiene-octene copolymer available from Dow, produced by metai!ocene-cata!yzed solution polymerization.

Exact™ plastomers are ethylene- alpha olefin copolymers available from

ExxonMobil produced by metailocene-catalyzed polymerization,

emamide® EZ is a fatty amide (erucamide) slip agent, available from

Chemtu ra.

Pentalyn® H tackifier resin has a ring & bail softening point of 94-102°C and is available from Pinova Solutions.

Piccolyte® A115, C115, and FI15 tackifier resins have a ring & bail softening point of ii2-ii8 ⁰ C and are available from Pinova Solutions.

Queo™ 7007LA polymer is an ethyiene-based octene-i piastomer with a melting point of 62 ^¾ 'C, produced by metailocene-catalyzed solution polymerization, available from Boreaiis.

Queo™ 8201 polymer is an ethyiene-based octene~l piastomer produced by nietallocene-cataiyzed solution polymerization, available from Boreaiis.

SySoid® 620 matting agent is an amorphous synthetic silica, available from

Grace,

Vistamaxx™ 5102 polymer is primarily composed of ssotactic propylene repeat units with random ethylene distribution available from ExxonMobil, produced by metaiiocene-cata!yzed polymerization,

Vistamaxx™ 6202 polymer is an ethylene-propylene elastomer available from ExxonMobil, produced by metaS!ocene-cataiyzed polymerization,

Heat seal strength (also referred to herei as peel strength) of coatings to high density polyethylene (HDPE) or poiypropyiene (PP) was assessed as follows. The coated polymer film, Le, the composite film, was sealed to HDPE or PP using a Sentinel heat sealer (Model 12 by Packaging Industries Group Inc.). Unless otherwise stated, the beat sealer parameters were: 350°F (~ 177°C) (top jaw), iOO°F (~ 38°C) (bottom jaw) / 1 second / 80 psi ( 552 kPa). In cases where the top Jaw was at some other temperature, the bottom jaw was still at approximately iOO°F (~ 38°€), with some siight variation. The sealed sample was marked and cut into 25mm width strips, and the heat sea! strength was determined by peel strength testing on an I STRON® mode! 4464 test machine. The jaws were set 50 mm apart. The upper ja held film piece of the sealed sample and travelled up at a speed of 250 mm / min, while the lower jaw held HDPE or PP piece of the sealed sample and was stationary. The average force needed to separate the two pieces of film was recorded. Five sealed sample pieces were measured for each coated sample. In the examples herein when a example is described as repeated and/or prepared the same as another example described herein it is prepared analogously to the previous example using the same ingredients used In the same amounts in the same manner except where otherwise Indicated,

Example CI and Examples 2, 3 & 4

Example CI (Comparative, heat seal composition comprising no POP resin)

This heat seal composition contained no POP resin, A heat seal coating solution was prepared by dissolving Eivax® 3180 (9.0 g, DuPont, 28% vinyl acetate by weight, ~60 wt% EVA resin by weight of th heat seal composition), Piccolyte® CI 15 tackifier resin (5.4 g, Pinova, ~36 wt% tackifier resin by weight of the heat seal composition), Syioid 620 (0.375 g, Grace ~2.5 wt% matting agent by weight of heat seal

composition) and Kemarnide® EZ (0.225 g, Chemtura ~1,5 w†% slip agent by weight of heat seal composition) In 100 ml of toluene at 65°C, This heat seal coating solution was coated on a 23 um (micron) PET polymer film primed with Eivax® 4260 EVA resin using a Mayer coating rod (coating weight, 5.5 g / m ^? ). The coated film, i.e. the composite film was dried for 2 min In a forced air oven preset to 115 °C. The composite fiim was sealed onto HDPE and PP substrates [300°F (~ i49°C) /i sec] and the seal strengths were 892 g force / inch (~ 344 N / m) (HDPE) and 615 g force / inch (~ 237 / m) (PP).

Example 2 (6 wt% POP)

Comparative Example Ci was repeated, except that 0.9 g of Elvax® 3180 resin was replaced by Queo™ 7007LA polymer to prepare a composite film of the invention. The other amounts of the ingredients were unchanged so the heat sea! composition of Example 2 comprised 8,1 g («54 wt%) EVA resin and 0,9 g POP resin (~6 wt%). The sea! strengths of the resultant composite film tested as described in Example CI. were 1105 g force / inch (~ 427 N / m) (HDPE) and 756 g force / inch (~ 292 N / m) (PP). Example 3 (30 wt% POP)

Comparative Example 1 was repeated, except that 4.5 g of Elvax® 3180 reslo was replaced by Queo™ 7007LA polymer to prepare a composite film of the invention, The other amounts of the ingredients were unchanged so the heat seal composition of Example 3 comprised 4.5 g (~30 wt%) EVA resin and 4.5 g POP resin (~30 wt%). The seal strengths of the resultant composite film tested as described in Example CI were 1447 g force / inch (« 559 N / m) (HDPE) and 761 g force / inch (~ 294 H / m) (PP). Exampie 4 (60 wt% POP)

Comparative Exampie 1 was repeated, except that the 9.0 g of Eivax® 3180 resin was replaced entirely by the same amount of Queo™ 7007LA polymer to prepare a composite film of the invention. The other amounts of the ingredients were unchanged so the heat seal composition of Exampie 3 comprised no EVA resin and 9.0 g POP ressn («60 wt%). The seal strengths of the resultant composite film tested as described In Example CI were 1415 force g / inch 546 N / m) (HDPE) and 743 g force / inch (~ 287 N / m) (PP),

Example C5 and Examples 6, 7 & 8

The heat seal coating of Ex 3 (Eivax® 3180 / Qoeo™ 7007LA / Piccoiyte®} effect of primer on PIT

Exampie C5 (Comparative - unprimed PET polymer film )

The PET poiymer film of Exampie CI was not primed (nor was it corona treated) and was used to provide a comparative exampie. Example 3 was repeated, except that coating weight was 6.5 g / m ³ on unprimed PET poiymer film. The sea! strengths were

744 g force / inch (~ 287 M / m) (HDPE) and 775 g force / inch (~ 299 N / m) (PP), A significant amount of heat seal coating was left on the HDPE and PP after sample testing, indicating poor adhesion between the heat seal coating and PET polymer film on non-corona treated PET film without a primer iayer.

Exam pi e.6 ( VdC primed PET pol y me r fil _m I

Example C5 was repeated, except that the PET poiymer film was primed with

PVdC. The sea! strengths were 1454 g force / inch (~ 561 N / m) (HDPE) and 815 g force / inch (~ 315 N m) (PP),

Exa oie 7 (EVA primed PET Doivmer fiim)

Example 5 was repeated, except that PET polymer film primed with E!vaxC?)

4260 EVA resin was used, The seal strengths were 1564 g force / Inch (~ 604 N / m)

(HDPE) and 791 g force / inch (~ 30S H / m) (PP).

Exampie 8 (EAA primed PET poiymer film)

Example 5 was repeated, excep that an EAA-primed PET poiymer film was used. The seal strengths were 712 g force / inc (~ 275 N / m) (HDPE) and 894 g force

/ inch (~ 345 N / m) (PP). The clean peei of the composite film from HDPE shows tha the heat seaiabie top coat is particu!ariy effective at adhering to the EAA primed PET polymer film and thus the composite film resists deiamination when peeled from a

HDPE surface.

Other POP and EVA resins (Examples 9 to 16)

Example 9

A heat seal coating solution was prepared by dissolving Elvax® 3185 (2.7 g, DuPont, 32% vinyl acetate by weight ~18 wt% EVA resin by weight of the heat seal composition),), Eivax® 4260 (2.7 g, DuPont, 28% vinyl acetate by weight ~18 wt% EVA resin by weight of the heat sea! composition), Affinity™ GAI950 (3,6g, DOW Chemical Company ~24 wt% POP resin by weight of the heat sea! composition), Piccoiyte® C115 (5.4 g, Pinova, ~36 wt% tackifier resin by weight of the heat seal composition),), Syioid 620 (0,375 g, Grace, ~2.5 wt% matting agent by weight of heat seal composition) and Kemamide® EZ (0.225 g, Chemtura ~1.5 wt% slip agent by weight of heat seal composition) in 100 ml of toluene at 65°€, This heat seal coating solution was coated on a 23 pm (micron) PET poiymer film primed with Eivax® 4260 EVA resin using a Mayer coating rod (coating weight, 6,5 g / m ² ). The coated fiim was dried for 2 minutes In a forced air oven preset to liS^C, The coated film, i.e. the composite fiirn _f was sealed on HOPE and PP substrates [300° F ~ I49°C} 1 sec] and the seal strengths were 1200 g force / inch ( 463 N / m) (HDPE) and 895 g force / inch (~ 346 N / m) (PP),

Exampje.lQ

Example 9 was repeated, except that PVdC-primed PET polymer film was used.

The seal strengths were 1300 g force / inch (~ 502 N / m (HDPE) and 847 g force / inch (~ 32? N / m) (PP).

Examoi l

Example 10 was repeated, except that the Affinity™ GA1950 POP resin was replaced by the same weight of Vistamaxx™ 6202 (ExxonMobil) (3.6 g ~24 wt% POP resin by weight of the heat seal composition). The seal strength was 1190 g force / inch (~ 459 N / m) (PP).

Example 12

Example 10 was repeated, except that the Affinity ^W 6A195G POP resin was replaced by the same weight of Vistamaxx™ 6102 (ExxonMobil) } (3.6 g ~ 24 wt% POP resin by weight of the beat seal composition). The 5,4g Piccolyte® CI 15 tackifier resin was replaced by the same weight of Pentaiyn® H tackifier resin (Pinova) ) (5,4 g ~ 36 wt% tackifier resin by weight of the heat seal composition). . The seal strength was 1080 g force / inc ^■■■ (« 417 N / m) (PP),

Examoje _. 13

Example 9 was repeated, except that the Affinity™ 6A1950 POP resin was replaced by the same weight of Queo™ 8201 POP poiymer ) (3.6 g ~ 24 wt% POP resin by weight of the beat seal composition).. The seal strengths were 1115 g force / inch (~ 430 N / m) (HDPE) and 714 g force / inch (~ 276 N / m) (PP).

Example 14

Example 10 was repeated, except that the Affinity™ GA1950 POP resin was replaced by the same weight of Queo""' 7007L POP poiymer (3,6 g ~24 wt POP resin by weight of the heat seal composition). The seal strengths were 1230 g force / inch ( 475 N / m) (HDPE) and 849 g force / inch (~ 337 N / m) (PP).

Example 5

Example 14 was repeated, except that Eivaxig) 3185 and Eivax® 4260 EVA resins were replaced together by the same total amount of £Svax<§> 420, iow-VA EVA resin (5.4 g 36 wt% EVA resin by weight of the heat seal composition). The sea! strengths were 1277 g force inch (~ 493 / m) (HOPE) and 923 g force / inch (« 356 W / m) (PP), The Elvax® 420 had very good compatibility with the Queo ^Tf " 7007LA POP polymer, as indicated by better film clarity.

Example 16

Example 9 was repeated, except that the Affinifcy™GA1950 POP resin was replaced by the same weight of Engage™ 8200 POP resin (DOW Chemical Company) (3,6 g ~24 wt% POP resin by weight of the heat seal composition) and coating weight was 8.5 g / m ³ . The sea! strengths were 1480 g force / inch (~ 571 N / m) (HOPE) and 1039 g force / inch (~ 422 N / m) (PP),

FIG. 1 shows peei strength as a function of the temperature at which heat sealing was performed for a composite film, comprising a PET polymer film primed with Eivax® 426C EVA resin and coated at 6.8 g / m ² with a heat sea! composition as described in Example 15, heat seaied to an HDPE substrate. Also shown are the corresponding results for a commerciaily available PET film extrusion-coated at about 12,5 g / m ² with a conventional EVA heat seal composition, heat sealed to an HOPE substrate under the same conditions,

FIG. 2 shows peei strength results for runs analogous to those depicted in FIG. l, with a polypropylene substrate instead of an HOPE substrate.

As seen in FIGS. 1 and 2, peel strengths were significantly higher using a heat seal composition according to the invention, and the pee! strengths were more neariy constant with respect to heat sealing temperature.

Effect of heat seal coating composition on seat strength to HOPE

(Example 17 and OS, C19 & C20)

Example 1?

A heat seal coating solution was prepared by dissolving EVA (6.12 g, Elvax®

4260 resin, DuPont ~25 wt% EVA resin by weight of the heat seal composition), POP (4,50g, Queo™ 7007LA polymer, ~2 wt% POP resin by weight of the heat seal composition), tackifier (6.6 6g, Picco!yte® CI 15, ~37 wt% tackifier resin by weight of the heat seal composition), in 100 ml of toluene at 65°C, followed by adding

Ke a ide-EZ (0.17 g 0.9 wt% s!ip agent by weight of the heat seal composition), emarnide W20 (0.15 g ~ 0,8 wt% slip agent by weight of the heat seal composition)) and SySoid 620 (0.40 g ~ 2,2 wt% matting agent by weight of th heat seal composition). This heat seal coating solution was coated on a 23 pm (micron) PVdC primed PET polymer film using a Mayer coating rod (coating weight, 6.5 g / m ² ). The coated film was dried at 1 !5°C in an oven for 2 minutes. The coated film, i.e. the composite film, was sealed onto a HDPE substrate [80 psi (~ 552 kPa) / 1 sec] st different temperatures, and seal strength was measured on an I ST O ® mode! 4464 test machine. Examples IS, C 19 & C20 (Co m parativ )

Comparative examples CIS to C20 were performed as in Example 17 using the heat seal compositions shown so Table 1, which reports the peel strengths in g force inch (with the pee! strength values in parentheses converted to H / m). These exarnpies were prepared as foiiows.

Exam pie C 18 (Com pa rative, too iittle tackifier)

Exampie 17 was repeated, except that the weight of the same Piccoiyte® CI 15 tackifier resin was reduced to 1,8 g (~10wt% tackifier resin by weight of the heat seai composition) and the weight of the same Elvax® 4260 EVA resin was increased to 10.98 g (~61 wt% EVA resin by weight of the heat seal composition), and the other ingredients (POP resin, siip agents and matting agent) remained the same and were presen at the same weight- Comparative Exampie€18 had a much lower amount of tackifier compared to the amount of tackifier used in heat seal layer that comprise the composite films of the present invention.

^arfl j6. l¾. CQrfl ¾tive....nQ. ¾ kifi. r)

Example 17 was repeated, except that the Piccoiyte® CI 15 tackifier resin was omitted and the weight of the same Eivax® 4260 EVA resin was increased to 12.78 g (~7l wt% EVA resin by weight of the heat seai composition), and the othe ingredients (POP resin, siip agents and matting agent) remained the same and were present at the same weight. Comparative Exampie C19 had no tackifier unlike the heat seal Iayer that comprise the composite films of the present invention.

Exampie 2Q (Comparative, no PO ..resin)

Exampie 17 was repeated,, except that the Queo' ^CT 7007LA POP resin was omitted and the weight of the same Eivax® 4260 EVA resin was increased to 10.62 g (^59 wt% EVA resin by weight of the heat seal composition), and the other ingredients (tackifier resin, slip agents and matting agent) remained the same and were present at the same weight. Comparative Exampie C20 had no POP resin unlike the heat seai layer that comprise the composite fiims of the present invention.

The difference between properties of these comparative films CIS, C19 and C20 and Exampie 17 can been seen in Table 1. Table 1

As can be seen compared to Examples CIS to 20, the composite film of the invention (Example 17) produced a strong heat seal even at a Sow sealing temperature and the seal strength was relatively constant over a wide sealing temperature range. Heat seai compositions with other tacktfiers {Examples 21 to 29}

Exampie 21

Exampie 21 was prepared the same as Example 17 except that Piccoiyte®ClI5 tackifier resin was repiaced by the same weight of Piccolyte® All 5 (Pi ova Solutions, ring & baii softening point 112-118°C) (6.66 g -37 wt% tackifier resin by weight of the heat sea! composition). The peel strength of the heat seal coating to HOPE, sealed at 350°F (~177°C) / 80 psi (~ 552 kPa) / 1 sec, was 1412 g force / inch (-542 N / m).

Exampie 22

Example 21 was prepared the same as Example 17 except that Piccolyte® CI 15 tackifier resin was repiaced by the same weight of Piccolyte® FI15 (Pinova Solutions, ring & bail softening point 112-118°C) (6.66 g -37 wt% tackifier resin by weight of the heat seai composition). The peel strength of the heat seal coating to HDPE, sealed at 350°F (~177°C) / 80 psi {- 552 kPa) / i se , was 1530 g force / inch (-591 N / m). Example 23

Example 21 was prepared the same as Example 17 except that Piccolyte® CI 15 tackifier resin was repiaced by the same weight of Piccolyte® C85 (Pinova Solutions, ring 8. bail softening point 82 to 88°C) (6-66 g -37 wt% tackifier resin by weight of the heat seal composition). The peel strength of the heat seal coating to HDPE, sealed at 350°F (-177 C) / 80 psi (- 552 kPa) 1 se , was 1389 g force / inch (-536 / m).

Exampie 24

Example 21 was prepared the same as Example 17 except that Piccolyte® CI 15 tackifier resin was repiaced by the same weight of Porai® 105 (Pinova Solutions, ring & bail softening point 95 tol03°C) (6.66 g -37 wt% tackifier resin by weight of the heat sea! composition). The pee! strength of the heat seal coating to HDPE, sealed at 350°F ( ^« i77*C) / 80 psi ( ^« 552 kPa) 1 sec , was 1240 g force / inch ( ^« 479 N m).

Example 25

Example 21 was prepared the same as Example 17 except that the Piccoiyte® C115 tack!fier resin was replaced by the same weight of Pentalyn® H (6,66 g ^« 37 wt tackifier resin by weight of the heat seal composition}. The peel strength of the heat seal coating to HDPE, sea!ed at 350°F ( ^« 177°C) / 80 psi ( ^« 552 kPa) / 1 sec, was 1286 g force / inch ( ^« 497 H / m).

Exampje.26

Example 26 was prepared the same as Example 17 except that 33% of the weight of Piccoiyte® CI 15 was replaced by Fora!® 105 (Pinova Solutions, ring & bail softening point 95 to 103°C) (4,44 g ^« 12.3 wt% tackifier resin by weight of the heat sea! composition). The peel strength of the heat seal coating to HDPE, sealed at 350°F (~177«C) / 80 psi ( ^« 552 kPa) / 1 sec , was 1353 g force / inch ( ^« 522 N / m).

Example 27

Example 26 was prepared the same as Example 17 except that Piccoiyte® C115 was replaced by Piccotac™ 6095-E (Eastman, ring & ball softening point 98°C) (6.66 g ^« 37 wt% tackifier resin by weight of the heat seal composition). The pee! strength of the heat sea! coating to HDPE, sea!ed at 350°F (~177°C) 80 psi {~ 552 kPa) / 1 sec, was 1290 g force / inch ( ^« 498 N / m).

Example 28

Example 26 was prepared the same as Example 17 except that Piccoiyte® CI 15 was replaced by ega!ite™ SHOO (Eastman, rin & ball softening point 100°C) (6.66 g ^« 37 wt tackifier resin by weight of the heat seal composition). The pee! strength of the heat seal coating to HDPE, sealed at 350°F ( ^« 177°C) / 80 psi ( ^« 55 kPa) / 1 se , was 1238 g force / inch ( ^« 478 N / m).

Example 29

Example 26 was prepared the same as Example 17 except that Piccoiyte® C115 was replaced by Fora!yn™ 90-FG (Eastman, ring & ball softening point 100°C) (6.66 g ^« 37 wt% tackifier resin by weight of the heat sea! composition). The pee! strength of the heat seal coating to HDPE, seaSed at 350°F (~17.7°C) / 80 psi £ ^« 552 kPa) / l sec, was 1311 g force inch ( ^« 506 H / m).

Heat seal compositions with higher tackifier content {Examples 30 & 31}

Examp!e 30 was prepared the same as Example 17 except that the weight ratio of EVA / POP / tackifser was 23 / 23 / 50 (respectively 4.14 g, 4.14 g and 9 g weight of these ingredients, the weights of the other ingredients being unchanged), The tackifier content was 50% by weight of the heat sea! composition. The pee! strength of the heat seal coating to HOPE, sealed at 35G°F (~I??°C) / 80 psi (<-* 552 kPa) / 1 se , was 1560 g force / inch (~6Q2 N / m).

Example 3

Example 30 was prepared the same as Example 17 except that the ratio of EVA / POP / tackifser was 18 / 18 / 60 (respectively 3,24 g, 3,24 g and 10,8 g weight of these ingredient, the weights of the other ingredients being unchanged. The tackifser content was 60% by weight of the heat seai composition. The peel strength of the heat seal coating to HOPE, seaied at 3S0°F (~177°C) / 80 psi (« 552 kPa) / 1 sec,„ was 1343 g force / inch (~519 N / m).

Film blocking and processabiiity evaluation of Examples 30 & 31

Roll samples were coated on a pilot coater with the high tackifier heat seai compositions of Examples 30 and 31 on PVdC-primed PET to evaluate film blocking and processabiiity. Heat seal coating solution temperature was 50°C, coated film drying temperature was i20°C; chiii roil temperature was 25°C. Both coated rolls were eastiy unwound without tearing. As seen in Table 2, the static and dynamic coefficient of friction (COF) vaiues were between 0.30 and ~0,50, within the typical range of COF for commerciai film products with good processabiiity.

Table 2

Comparison of two coatings for heat seaimg to HDPE and PP (Examples 32 & 33)

Exampie 32

The heat seal coating solution of Exampie 17 was prepared except that the Eivax® 4260 EVA resin was replaced with the same weight of Elvax® 420 EVA resin,. (DuPont 18% vinyl acetate by weight ~ 6.12 g ~ 25 wt% EVA resin by weight of the heat seai composition) the other ingredients being the same and present in the same weight. This solution was coated on a 23 μ?τι PET film primed with E!vax® 4260 EVA resin using a Mayer coating rod (coating weight, 3,5 g / m ^? ). The coated film was dried at 115°C in an oven for 2 minutes.

Example 33

The Example 32 was repeated, but the coating weight was 10 g / m ² .

The coated films, i.e. the composite films prepared in Examples 32 and 33 were heat seaied to HDPE and PP substrates at 80 psi (~ 552 kPa) wit a one second dwell time at different temperatures, and the seai strengths in g force / inch were measured on an INST ON® model 4464 test machine. The results for HDPE are shown in Table 3, and for PP in Table 4 (with the peel strength values in g force inch and in parentheses converted to N m).

Tabie 3 - HDPE

Table 4 - PP

As seen in Examples 32 and 33, the composite films comprising a heat seal layer with the Elvax® 420 EVA resin with a vinyi acetate content of 18% showed strong peel strength to both HDPE and PP substrates.

Comparison of Exampie 17 with Comparative Exampie C34 - A composite film comprising an extrusion-coated heat seat layer

Exampie 17 was compared against a commerciaily available PET film bearing an extrusion-coated LDPE (low density polyethylene) heat seal layer (Comparative

Example C34), The results are shown i Tabie 5 (with the peel strength values in g force / inch and in parentheses converted to N / m).

Table 5

HDPE substrate,, seal conditions: 80 ps! (~ 552 kPa) / 1 sec.

As seen in Table 5, Example 17 provided a peeiabie product with consistent peel strength, while the extrusion product (Example C34) had dramatically Increased seal strength that resulted in shredding of the film during the peel test, and/or a

unpeeiable weld seal.

Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims without departing from the invention.