Title:
COMPOSITE PROCESSING SYSTEM AND LASER CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/199879
Kind Code:
A1
Abstract:
In the present invention, a section of a workpiece having a coating member is laser-cut in a composite processing system. The system is provided with a laser-irradiating part that irradiates laser light at the surface of the section to be cut, an incision-forming part that forms an incision on the reverse surface of the section to be cut, a workpiece-moving part that moves the workpiece horizontally in a relative manner, and a control unit. The control unit controls the operation of the incision-forming part and the workpiece-moving part, and causes an incision to be formed on the reverse surface of the section to be cut and causes a base material portion of the workpiece to become exposed from the coating member before the laser light is irradiated towards the surface of the section to be cut.
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Inventors:
KOBAYASHI RYU (JP)
NAKAMURA YUKI (JP)
SAGIYA ISAMU (JP)
NAKAMURA YUKI (JP)
SAGIYA ISAMU (JP)
Application Number:
PCT/JP2017/018063
Publication Date:
November 23, 2017
Filing Date:
May 12, 2017
Export Citation:
Assignee:
AMADA HOLDINGS CO LTD (JP)
International Classes:
B23K26/38; B23K26/60; B23P23/00
Foreign References:
| JP2016025112A | 2016-02-08 | |||
| JPH07236984A | 1995-09-12 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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