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Patent Searching and Data


Title:
COMPOSITE RESIN COMPOSITION, AND CONNECTOR FORMED FROM SAID COMPOSITE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/066417
Kind Code:
A1
Abstract:
A composite resin composition with excellent flowability, with which it is possible to achieve the manufacture of a connector which has excellent heat resistance and in which warp deformation and blistering are suppressed, and a connector formed from said composite resin composition are provided. This composite resin composition contains (A) a liquid crystal polymer, (B) a fibrous filler, and (C) a plate-form filler. As an essential constituent component, the liquid crystal polymer (A) contains a wholly aromatic polyester amide which comprises prescribed amounts of structural units (I) to (VI) and exhibits optical anisotropy during melting. The weight average fiber length of the fibrous filler (B) is less than or equal to 200 μm.

Inventors:
FUKATSU HIROKI (JP)
TAKI TOMOHIRO (JP)
Application Number:
PCT/JP2017/034795
Publication Date:
April 12, 2018
Filing Date:
September 26, 2017
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L77/12; C08G69/44; C08K7/00; H01R12/72; H01R13/46
Domestic Patent References:
WO2017068869A12017-04-27
WO2016088714A12016-06-09
WO1998056578A11998-12-17
WO2014050371A12014-04-03
WO2012137636A12012-10-11
Foreign References:
JP2014533325A2014-12-11
JP2016124947A2016-07-11
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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