Title:
COMPOSITE RESIN COMPOSITION AND CONNECTOR MOLDED FROM SAME
Document Type and Number:
WIPO Patent Application WO/2018/074156
Kind Code:
A1
Abstract:
Provided are: a composite resin composition from which a connector having exceptional heat resistance and reduced occurrence of warpage and blisters can be produced, said composite resin composition having favorable fluidity; and a connector molded from the composite resin composition. This composite resin composition includes a liquid crystal polymer (A), a fibrous filler (B), and a plate-like filler (C). The liquid crystal polymer (A) is a wholly aromatic polyester amide comprising predetermined amounts of constituent units (I) to (V) as essential components and exhibiting optical anisotropy in a molten state, and the weight-average fiber length of the fibrous filler (B) is 200 μm or less.
Inventors:
FUKATSU HIROKI (JP)
TAKI TOMOHIRO (JP)
TAKI TOMOHIRO (JP)
Application Number:
PCT/JP2017/034663
Publication Date:
April 26, 2018
Filing Date:
September 26, 2017
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L77/12; C08G69/44; C08K7/00; H01R12/72; H01R13/46
Domestic Patent References:
| WO2017068869A1 | 2017-04-27 | |||
| WO2016088714A1 | 2016-06-09 | |||
| WO1998056578A1 | 1998-12-17 | |||
| WO2014050371A1 | 2014-04-03 | |||
| WO2013115168A1 | 2013-08-08 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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