Title:
COMPOSITE SENSOR AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2011/145729
Kind Code:
A1
Abstract:
Provided is a composite sensor wherein the detection sensitivities of an acceleration sensor and an angular velocity sensor are improved by sealing the respective sensors in pressure atmospheres corresponding thereto in the process of a series of joining steps.
A movable body (111) of an acceleration sensor (11) and a vibrating body (121) of an angular velocity sensor (12) are produced with a wall (16) interposed therebetween on the same sensor wafer (10). A gap wafer (20) in which gaps (21, 22) corresponding to the movable body (111) and the vibrating body (121) of the acceleration sensor (11) and the angular velocity sensor (12) are provided is formed, and a bump (23) is disposed near the gap (22) of the angular velocity sensor (12). After the angular velocity sensor (11) is sealed at an atmospheric pressure, a high-temperature high load is applied, and the angular velocity sensor (12) is vacuum-sealed. Thereafter, a composite sensor is formed by dicing with a diamond grindstone and mounting a circuit substrate and a wiring substrate.
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Inventors:
AONO TAKANORI (JP)
SUZUKI KENGO (JP)
KOIDE AKIRA (JP)
HAYASHI MASAHIDE (JP)
SUZUKI KENGO (JP)
KOIDE AKIRA (JP)
HAYASHI MASAHIDE (JP)
Application Number:
PCT/JP2011/061671
Publication Date:
November 24, 2011
Filing Date:
May 20, 2011
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
AONO TAKANORI (JP)
SUZUKI KENGO (JP)
KOIDE AKIRA (JP)
HAYASHI MASAHIDE (JP)
AONO TAKANORI (JP)
SUZUKI KENGO (JP)
KOIDE AKIRA (JP)
HAYASHI MASAHIDE (JP)
International Classes:
G01C19/56; G01C19/5769; G01P15/08; H01L21/50; H01L23/02
Domestic Patent References:
| WO2005118463A1 | 2005-12-15 | |||
| WO2010119573A1 | 2010-10-21 |
Foreign References:
| JP2010107325A | 2010-05-13 | |||
| JPH1082705A | 1998-03-31 | |||
| JP2007059736A | 2007-03-08 | |||
| JP2005016965A | 2005-01-20 | |||
| JP2002005950A | 2002-01-09 | |||
| JP2002005950A | 2002-01-09 | |||
| JP2008501535A | 2008-01-24 |
Other References:
See also references of EP 2573514A4
Attorney, Agent or Firm:
The Patent Body Corporate TAKEWA INTERNATIONAL PATENT OFFICE (JP)
Patent business corporation Takekazu international patent firm (JP)
Patent business corporation Takekazu international patent firm (JP)
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Claims: