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Title:
COMPOSITE SENSOR AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2011/145729
Kind Code:
A1
Abstract:
Provided is a composite sensor wherein the detection sensitivities of an acceleration sensor and an angular velocity sensor are improved by sealing the respective sensors in pressure atmospheres corresponding thereto in the process of a series of joining steps. A movable body (111) of an acceleration sensor (11) and a vibrating body (121) of an angular velocity sensor (12) are produced with a wall (16) interposed therebetween on the same sensor wafer (10). A gap wafer (20) in which gaps (21, 22) corresponding to the movable body (111) and the vibrating body (121) of the acceleration sensor (11) and the angular velocity sensor (12) are provided is formed, and a bump (23) is disposed near the gap (22) of the angular velocity sensor (12). After the angular velocity sensor (11) is sealed at an atmospheric pressure, a high-temperature high load is applied, and the angular velocity sensor (12) is vacuum-sealed. Thereafter, a composite sensor is formed by dicing with a diamond grindstone and mounting a circuit substrate and a wiring substrate.

Inventors:
AONO Takanori (HITACHI LTD., 832-2, Horiguchi, Hitachinaka-sh, Ibaraki 34, 〒3120034, JP)
青野 宇紀 (〒34 茨城県ひたちなか市堀口832番地2 株式会社日立製作所 機械研究所内 Ibaraki, 〒3120034, JP)
SUZUKI Kengo (HITACHI LTD., 832-2, Horiguchi, Hitachinaka-sh, Ibaraki 34, 〒3120034, JP)
鈴木 健悟 (〒34 茨城県ひたちなか市堀口832番地2 株式会社日立製作所 機械研究所内 Ibaraki, 〒3120034, JP)
Application Number:
JP2011/061671
Publication Date:
November 24, 2011
Filing Date:
May 20, 2011
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS, LTD. (2520, Takaba Hitachinaka-sh, Ibaraki 03, 〒3128503, JP)
日立オートモティブシステムズ株式会社 (〒03 茨城県ひたちなか市高場2520番地 Ibaraki, 〒3128503, JP)
AONO Takanori (HITACHI LTD., 832-2, Horiguchi, Hitachinaka-sh, Ibaraki 34, 〒3120034, JP)
青野 宇紀 (〒34 茨城県ひたちなか市堀口832番地2 株式会社日立製作所 機械研究所内 Ibaraki, 〒3120034, JP)
SUZUKI Kengo (HITACHI LTD., 832-2, Horiguchi, Hitachinaka-sh, Ibaraki 34, 〒3120034, JP)
International Classes:
G01C19/56; G01C19/5769; G01P15/08; H01L21/50; H01L23/02
Domestic Patent References:
WO2005118463A12005-12-15
WO2010119573A12010-10-21
Foreign References:
JP2010107325A2010-05-13
JPH1082705A1998-03-31
JP2007059736A2007-03-08
JP2005016965A2005-01-20
JP2002005950A2002-01-09
JP2002005950A2002-01-09
JP2008501535A2008-01-24
Other References:
See also references of EP 2573514A4
Attorney, Agent or Firm:
The Patent Body Corporate TAKEWA INTERNATIONAL PATENT OFFICE (Kashiwaya Bldg, 6-13 Nishishinbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: