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Title:
COMPOSITE SENSOR AND COMPOSITE SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2014/020950
Kind Code:
A1
Abstract:
In this composite sensor (11), the region (R1) where thermal image sensors (16) are arranged and the region (R2) where distance image sensors (31) are arranged overlap seen from the lamination direction. Thus, it is possible to obtain thermal images and distance images on the same axis and suppress image misalignment between the thermal images and the distance images. Furthermore, in this composite sensor (11), the space around the thermal image sensors (16) is sealed in a vacuum state by means of a sealing body (S1) formed by laminating a first substrate (13) and a second substrate (14). By this means, it is possible to prevent heat generated around the distance image sensors (31) from affecting the thermal sensors (16). In addition, the degree of freedom in design can be ensured because the substrate where the thermal sensors (16) are arranged the substrate where the distance sensors (31) are arranged are separate.

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Inventors:
OJIMA FUMIKAZU (JP)
MASE MITSUHITO (JP)
SAKURAI NAOTO (JP)
Application Number:
PCT/JP2013/061296
Publication Date:
February 06, 2014
Filing Date:
April 16, 2013
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01V8/20; G01B11/00; G01J1/02; G01S17/86; H01L27/146; H04N5/33; H04N5/335; G01S17/894
Domestic Patent References:
WO2007086424A12007-08-02
Foreign References:
JP2009014459A2009-01-22
JP2001318165A2001-11-16
JP2011232606A2011-11-17
JP2001318165A2001-11-16
JP2011514709A2011-05-06
JP2011232606A2011-11-17
Other References:
See also references of EP 2881761A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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