COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION, METHOD FOR PRODUCING COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION, AND METHOD FOR PRODUCING CHIP WITH PROTECTIVE FILM

WIPO Patent Application WO/2014/142151

A1

[Problem] To provide a composite sheet for protective film formation, which has good holding power with respect to a jig such as a ring frame and excellent releasability at the time of pick-up, and which is capable of preventing defects that are caused by decrease in adhesion between a second adhesive layer and an adhesive layer (a first adhesive layer) of an adhesive sheet. [Solution] A composite sheet for protective film formation according to the present invention comprises a film for protective film formation on a first adhesive layer of an adhesive sheet, which comprises a base and the first adhesive layer as constituent layers, with a second adhesive layer being interposed therebetween. The shape of the second adhesive layer is contained in the shape of the adhesive sheet when viewed in plan; the first adhesive layer is formed of an energy ray-curable adhesive or an adhesive that is obtained by curing an energy ray-curable adhesive; the second adhesive layer is formed of an adhesive that is obtained by curing an energy ray-curable adhesive; and the tensile modulus of the second adhesive layer at 25°C is 200-2,000 MPa.

TAKANO KEN (JP)
KABUTO AKIO (JP)

PCT/JP2014/056436

September 18, 2014

March 12, 2014

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LINTEC CORP (JP)

H01L21/301; B32B27/00; B32B27/16; C09J7/20; C09J11/06; C09J201/00

WO2008047610A1

2008-04-24

JP2012033637A	2012-02-16
JP2012033636A	2012-02-16

MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)

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