Title:
COMPOSITE STRUCTURE, AND SEMICONDUCTOR MANUFACTURING DEVICE PROVIDED WITH COMPOSITE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/162741
Kind Code:
A1
Abstract:
Disclosed are a member for a semiconductor manufacturing device and a semiconductor manufacturing device, said member being provided with a superior particle resistance property (low-particle generation). This composite structure comprises: a substrate; and a structure that is provided on the substrate and has a surface which is exposed to a plasma atmosphere, wherein the structure includes a Y2O3–ZrO2 solid solution (YZrO) as the primary component thereof, and the Y2O3 content of the YZrO is 20 to 40 mol%. This composite structure has superior particle resistance and is suitably used as a member for a semiconductor manufacturing device.
Inventors:
ASHIZAWA HIROAKI (JP)
TAKIZAWA RYOTO (JP)
TAKIZAWA RYOTO (JP)
Application Number:
PCT/JP2023/004708
Publication Date:
August 31, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
TOTO LTD (JP)
International Classes:
H01L21/3065; C23C24/04; H01L21/205; H01L21/31
Foreign References:
JP2022510433A | 2022-01-26 | |||
JP2008239385A | 2008-10-09 | |||
JP2019183278A | 2019-10-24 | |||
US20190131113A1 | 2019-05-02 |
Attorney, Agent or Firm:
KONNO, Akio et al. (JP)
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