COMPOSITE SUBSTRATE MANUFACTURING METHOD

Title:

COMPOSITE SUBSTRATE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/047604

Kind Code:

A1

Abstract:

A composite substrate manufacturing method of the present invention comprises: (a) a step of mirror-polishing a piezoelectric substrate side of a bonded substrate which comprises a piezoelectric substrate and a support substrate bonded to each other and which has a diameter of not less than 2 inches, until the thickness of the piezoelectric substrate becomes 20 μm or less; (b) a step of performing ion beam processing so that an outer peripheral portion of the piezoelectric substrate becomes thicker than an inner peripheral portion and that the difference between the maximum value and the minimum value of the thickness of the inner peripheral portion of the piezoelectric substrate is not more than 100 nm across the entire surface; and (c) a step of performing CMP polishing using a polishing pad with a diameter of not less than 5 mm and not more than 30 mm, wherein the polishing pad is moved and rotated while a constant pressing force of the polishing pad is maintained, so as to remove at least a part of an altered layer produced by the ion beam processing, thereby making the entire surface of the piezoelectric substrate flat.

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Inventors:

KITAMURA KAZUMASA (JP)
NAGAE TOMOKI (JP)

Application Number:

PCT/JP2016/077032

Publication Date:

March 23, 2017

Filing Date:

September 14, 2016

Export Citation:

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Assignee:

NGK INSULATORS LTD (JP)

International Classes:

H01L41/337; B24B37/10; H01L41/18; H01L41/312; H01L41/335; H03H3/08

Domestic Patent References:

WO2014104098A1	2014-07-03
WO2014156507A1	2014-10-02

Foreign References:

JP2015145054A	2015-08-13
JP2001308049A	2001-11-02
JP2001118812A	2001-04-27

Attorney, Agent or Firm:

ITEC INTERNATIONAL PATENT FIRM (JP)

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