Title:
COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/158636
Kind Code:
A1
Abstract:
Disclosed is a composite substrate provided with a piezoelectric substrate, a support substrate made of spinel, and an organic adhesive layer for adhering the piezoelectric substrate and the support substrate, wherein the support substrate comprises an adhesive surface to be adhered to the piezoelectric substrate and the adhesive surface has an Rt (maximum cross sectional height of a roughness curve) of 5 nm or more and 50 nm or less.
Inventors:
SUZUKI, Kenji (2-56, Suda-cho, Mizuho-ku, Nagoya-cit, Aichi 30, 〒4678530, JP)
Application Number:
JP2011/062246
Publication Date:
December 22, 2011
Filing Date:
May 27, 2011
Export Citation:
Assignee:
NGK INSULATORS, LTD. (2-56, Suda-cho Mizuho-ku, Nagoya-cit, Aichi 30, 〒4678530, JP)
日本碍子株式会社 (〒30 愛知県名古屋市瑞穂区須田町２番５６号 Aichi, 〒4678530, JP)
日本碍子株式会社 (〒30 愛知県名古屋市瑞穂区須田町２番５６号 Aichi, 〒4678530, JP)
International Classes:
H03H9/25; H01L41/18; H01L41/22
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (Pola-Nagoya Bldg, 9-26 Sakae 2-chome, Naka-ku, Nagoya-sh, Aichi 08, 〒4600008, JP)
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Claims: