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Patent Searching and Data


Title:
COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/027048
Kind Code:
A1
Abstract:
A composite substrate according to the present invention is a plate-shaped body in which a first substrate and a second substrate overlap each other. A hole is formed in a thickness direction of the plate-shapedbody, from the first substrate through the second substrate. The ratio A/B of the average thickness A of the first substrate to the average thickness B of the second substrate is 1/5 or less. The interface between the first substrate and the second substrate on an inner wall of the plate-shaped body in the hole has a portion covered with a coating layer containing a component constituting the second substrate.

Inventors:
HAMAZONO KOJI (JP)
Application Number:
PCT/JP2019/029644
Publication Date:
February 06, 2020
Filing Date:
July 29, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H03H9/25
Domestic Patent References:
WO2010119796A12010-10-21
WO2016084936A12016-06-02
Foreign References:
JP2013156102A2013-08-15
JP2000277457A2000-10-06
JP2017169139A2017-09-21
JP2017112155A2017-06-22
JP2013165100A2013-08-22
JPH0945762A1997-02-14
Other References:
See also references of EP 3832887A4
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