COMPOSITE WIRING BOARD PROVIDED WITH A PLURALITY OF WIRING BOARDS CONNECTED VIA CONNECTING MEMBERS, CONNECTING MEMBER MANUFACTURING METHOD, CONNECTING MEMBER, AND PRESSURE SENSOR

WIPO Patent Application WO/2016/113971

A1

[Problem] To provide a composite wiring board wherein partial restoration can be easily performed. [Solution] This composite wiring board is provided with a plurality of wiring boards that are aligned adjacent to each other, and connecting members, each of which electrically connects two wiring boards adjacent to each other. Each of the connecting members includes a plurality of conductive members that electrically connect a plurality of electrode sections of one wiring board and a plurality of electrode sections of the other wiring board to each other. Each of the conductive members has a conductive adhesive layer containing an adhesive, and a plurality of conductive particles added to the adhesive. Each of the conductive members is disposed such that the conductive adhesive layer is in contact with the electrode sections of the one wiring board and the electrode sections of the other wiring board. The conductive adhesive layer has conductivity in both the thickness direction and the planar direction.

NAGAE MITSUTAKA (JP)
TOMINO KEN (JP)
FUJIMOTO SHINYA (JP)
MIYOSHI TORU (JP)

PCT/JP2015/080105

July 21, 2016

October 26, 2015

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DAINIPPON PRINTING CO LTD (JP)

H05K1/14; H01L21/336; H01L29/786

JP2000299544A	2000-10-24
JP2971722B2	1999-11-08
JP2014222701A	2014-11-27
JPH10284818A	1998-10-23
JP2010079196A	2010-04-08
JP2012132960A	2012-07-12
JP2013068562A	2013-04-18
JPS6310588A	1988-01-18

KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)

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