Title:
COMPOSITE WOVEN FABRIC AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2008/059741
Kind Code:
A1
Abstract:
Disclosed is a printed wiring board which attains aims of printed wiring boards
required for realizing high-speed, high-frequency semiconductor devices,
namely a printed wiring board having low dielectric constant, low dielectric
loss tangent and low linear expansion coefficient. Also disclosed is a composite
woven fabric suitably used as a base for such a printed wiring board. Specifically
disclosed is a composite woven fabric containing a quartz glass fiber and a polyolefin
fiber, wherein the ratio of the quartz glass fiber in the composite woven fabric
is set at not less than 10% by volume but not more than 90% by volume. It is preferable
that the quartz glass fiber has a filament diameter of not less than 3 μm
but not more than 16 μm, and the composite woven fabric has a thickness of
not more than 200 μm.
Inventors:
SATO AKIRA (JP)
FUJINOKI AKIRA (JP)
NISHIMURA HIROYUKI (JP)
SAKAGUCHI TSUKASA (JP)
FUJINOKI AKIRA (JP)
NISHIMURA HIROYUKI (JP)
SAKAGUCHI TSUKASA (JP)
Application Number:
PCT/JP2007/071641
Publication Date:
May 22, 2008
Filing Date:
November 07, 2007
Export Citation:
Assignee:
SHINETSU QUARTZ PROD (JP)
SATO AKIRA (JP)
FUJINOKI AKIRA (JP)
NISHIMURA HIROYUKI (JP)
SAKAGUCHI TSUKASA (JP)
SATO AKIRA (JP)
FUJINOKI AKIRA (JP)
NISHIMURA HIROYUKI (JP)
SAKAGUCHI TSUKASA (JP)
International Classes:
D03D15/00; D02G3/04; D02G3/18; D02G3/44; D03D1/00; D03D15/12; H05K1/03
Domestic Patent References:
| WO2004110951A1 | 2004-12-23 |
Foreign References:
| JPH03124838A | 1991-05-28 | |||
| JP2006282401A | 2006-10-19 |
Attorney, Agent or Firm:
ISHIHARA, Shoji et al. (No. 302 Wakai Bldg.,7-8, Higashi-Ikebukuro 3-chome,Toshima-ku, Tokyo 13, JP)
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