Title:
COMPOSITION FOR ADHESIVE AGENT, FILM-LIKE ADHESIVE AGENT, SEMICONDUCTOR PACKAGE USING FILM-LIKE ADHESIVE AGENT, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/053566
Kind Code:
A1
Abstract:
Provided is a composition for an adhesive agent, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler material (D), wherein: the polyurethane resin (C) has a tanδ peak top temperature of at least 0 °C in a dynamic viscoelasticity measurement; and the proportion of the polyurethane resin (C) in the total content of the epoxy resin (A) and the polyurethane resin (C) is 2-50 mass%.
Inventors:
MORITA MINORU (JP)
Application Number:
PCT/JP2022/020970
Publication Date:
April 06, 2023
Filing Date:
May 20, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J163/00; C09J7/35; C09J11/04; C09J175/04; H01L21/301; H01L21/52
Domestic Patent References:
| WO2018211887A1 | 2018-11-22 | |||
| WO2022085563A1 | 2022-04-28 |
Foreign References:
| US20140113983A1 | 2014-04-24 | |||
| JP2007314742A | 2007-12-06 | |||
| JP2013525515A | 2013-06-20 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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