Title:
COMPOSITION, BONDING MATERIAL, SINTERED COMPACT, ASSEMBLY, AND METHOD FOR PRODUCING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/017065
Kind Code:
A1
Abstract:
This composition contains a metal component which can undergo transitional liquid-phase sintering. The metal component contains metal particles A having a melting point higher than 300°C, and metal particles B having a melting point not exceeding 300°C. The void volume X (in cm3) of the metal particles A, the density Y (in g/cm3) of the metal particles B, and the mass Z (in g) of the metal particles B satisfy the formula: 0.8≤Z/XY≤1.2.
Inventors:
YAMAGISHI HIDEAKI (JP)
UENO FUMITAKA (JP)
SAITO KOICHI (JP)
TAKEUCHI MASAKI (JP)
YAMAMOTO TAKAYA (JP)
UMEZAKI SHOTA (JP)
SAKAIRI YOHKO (JP)
UENO FUMITAKA (JP)
SAITO KOICHI (JP)
TAKEUCHI MASAKI (JP)
YAMAMOTO TAKAYA (JP)
UMEZAKI SHOTA (JP)
SAKAIRI YOHKO (JP)
Application Number:
PCT/JP2018/035437
Publication Date:
January 23, 2020
Filing Date:
September 25, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B22F7/08
Foreign References:
| JP2017222930A | 2017-12-21 | |||
| JP2018515348A | 2018-06-14 | |||
| JP2003534454A | 2003-11-18 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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