Title:
COMPOSITION FOR BONDING, OPTICAL ADHESIVE, AND ADHESIVE FOR PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2017/204145
Kind Code:
A1
Abstract:
Provided are: a composition for bonding which, after bonding, forms an adhesive layer that is less apt to deform and can retain high adhesive force even after a reliability test; and an optical adhesive and an adhesive for pressure sensors both comprising the composition.
The composition for bonding contains resin particles. The resin particles have a degree of recovery of 20% or less. A cured object having a thickness of 250±50 µm formed from the composition for bonding has a moisture permeability of 90 g/m2-24 h or less. The adhesive layer formed from the composition for bonding is less apt to deform and can retain high adhesive force even after a reliability test.
Inventors:
UEDA SAORI (JP)
YAMADA YASUYUKI (JP)
YAMADA YASUYUKI (JP)
Application Number:
PCT/JP2017/018992
Publication Date:
November 30, 2017
Filing Date:
May 22, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J11/08
Domestic Patent References:
| WO2017082353A1 | 2017-05-18 |
Foreign References:
| JP2012136614A | 2012-07-19 | |||
| JP2008239638A | 2008-10-09 | |||
| JP2004099863A | 2004-04-02 |
Other References:
See also references of EP 3467070A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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