Title:
COMPOSITION FOR BONDING
Document Type and Number:
WIPO Patent Application WO/2019/142633
Kind Code:
A1
Abstract:
The present invention provides a composition for bonding, which enables bonding without pressurization at relatively low temperatures, and which enables the achievement of excellent bonding strength. A composition for bonding according to the present invention contains first metal particles that have an average particle diameter of 20-100 nm and a dispersion medium; and the content of the dispersion medium relative to the entire amount of the composition for bonding is 1.0% by weight or more but less than 5.0% by weight.
Inventors:
NAKAJIMA NAOYA (JP)
MATSUI MIKI (JP)
MATSUI MIKI (JP)
Application Number:
PCT/JP2018/047824
Publication Date:
July 25, 2019
Filing Date:
December 26, 2018
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
H01B1/22; B22F1/00; B22F1/102; B22F9/00; B22F9/30; B82Y30/00; H01B1/00
Domestic Patent References:
| WO2017085909A1 | 2017-05-26 | |||
| WO2014185073A1 | 2014-11-20 | |||
| WO2017006531A1 | 2017-01-12 | |||
| WO2015190076A1 | 2015-12-17 | |||
| WO2017213170A1 | 2017-12-14 |
Foreign References:
| JP2017155166A | 2017-09-07 | |||
| JP2012174480A | 2012-09-10 | |||
| JP2017111975A | 2017-06-22 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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