Title:
COMPOSITION FOR CHEMICAL ETCHING OF COPPER-MOLYBDENUM ALLOY FILM
Document Type and Number:
WIPO Patent Application WO/2020/062590
Kind Code:
A1
Abstract:
Disclosed is a composition for chemical etching of a copper-molybdenum alloy film, the composition containing the following components, with the total weight of the composition for chemical etching being 100%: 5%-15% of hydrogen peroxide, 0.5%-5% of an organic acid, 0.1%-5% of a hydrogen peroxide stabilizer, 2.0%-7.0% of a metal chelator, 0.001%-0.5% of an etching additive, 0.03%-0.1% of a surfactant, 0.005%-0.05% of a phosphate ester substance, and 3.0%-7.0% of a pH regulator, the balance being deionized water. The composition for chemical etching has the advantages of high-efficiency and high-precision etching, a long service life, no etching residues being generated during etching, mild reaction conditions, convenient operations, etc.
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Inventors:
ZHAO DACHENG (CN)
KANG WEI (CN)
CHEN SIYU (CN)
ZHENG CHUNHUAI (CN)
YAN YANHUA (CN)
ZHANG WENTAO (CN)
KANG WEI (CN)
CHEN SIYU (CN)
ZHENG CHUNHUAI (CN)
YAN YANHUA (CN)
ZHANG WENTAO (CN)
Application Number:
PCT/CN2018/119835
Publication Date:
April 02, 2020
Filing Date:
December 07, 2018
Export Citation:
Assignee:
HUIZHOU CAPCHEM CHEMICALS CO LTD (CN)
International Classes:
C23F1/44
Foreign References:
| CN106637209A | 2017-05-10 | |||
| CN104480469A | 2015-04-01 | |||
| CN105648439A | 2016-06-08 | |||
| CN107090581A | 2017-08-25 | |||
| KR20160114825A | 2016-10-06 |
Attorney, Agent or Firm:
SHENZHEN QIANNA PATENT AGENCY LTD (CN)
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