COMPOSITION, CLOSELY ADHERING FILM, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT PATTERN, AND METHOD FOR PRODUCING CIRCUIT BOARD

WIPO Patent Application WO/2018/190337

A1

Provided are: a composition which has excellent adhesiveness and wettability; a closely adhering film; a laminate; a method for producing a cured product pattern; and a method for producing a circuit board. A composition for forming a closely adhering film for imprinting, which contains a solvent and a compound 1 or a compound group 2, and wherein the compound 1 or the like is a compound that is able to be decomposed into two or more compounds if the polarity converting group is processed, at least one of which has a molecular weight of 30-400 and at least another one of which has a molecular weight of 1,000 or more. Compound 1: A resin which has a polymerizable group and a polarity converting group, and which has the polarity converting group in the main chain and/or in a side chain. In cases where the resin has the polarity converting group in a side chain, the polarity converting group is bonded to the main chain of the resin via a linking group and the number of atoms that constitute the chain of the linking group is 8 or more. Compound group 2: A compound which has a polymerizable group but does not have a polarity converting group and a compound which does not have a polymerizable group but has a polarity converting group.

SHIMOJU NAOYA (JP)
SHIBUYA AKINORI (JP)
GOTO YUICHIRO (JP)

PCT/JP2018/015057

October 18, 2018

April 10, 2018

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FUJIFILM CORP (JP)

H01L21/027; C08F8/00; C08F290/12

WO2016148095A1

2016-09-22

JP2016146468A	2016-08-12
JP2014192178A	2014-10-06
JP2014024322A	2014-02-06
JP2012086484A	2012-05-10

SIKS & CO. (JP)

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