Title:
COMPOSITION, COMPOUND, RESIN, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157655
Kind Code:
A1
Abstract:
The present invention provides a composition for semiconductor devices, the composition having excellent removability of residues, while being suppressed in dissolution of tungsten. This composition for semiconductor devices contains a resin which has a repeating unit A that is derived from a polymerizable compound having a nitrogen atom, and water; the ClogP of the polymerizable compound is 0.5 or more; and the solubility of the resin in water at 25°C is 0.01% by mass or more.
Inventors:
SHIMOJU NAOYA (JP)
SUGISHIMA YASUO (JP)
TAKAHASHI TOMONORI (JP)
SUGISHIMA YASUO (JP)
TAKAHASHI TOMONORI (JP)
Application Number:
PCT/JP2023/003361
Publication Date:
August 24, 2023
Filing Date:
February 02, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/304; C11D3/37; C11D7/32; G03F7/42
Domestic Patent References:
| WO2014171352A1 | 2014-10-23 |
Foreign References:
| JP2011080023A | 2011-04-21 | |||
| JPS53120794A | 1978-10-21 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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