Title:
COMPOSITION CONTAINING METAL MICROPARTICLES
Document Type and Number:
WIPO Patent Application WO/2011/065135
Kind Code:
A1
Abstract:
Disclosed is a composition containing silver microparticles, which comprises many silver microparticles (2) and a coating layer (4) that coats the surface of each of the silver particles (2). The silver particles (2) are so-called nano-particles. Each of the silver particles (2) has a scale-like shape. The coating layer (4) comprises an organic compound. The organic compound is adhered to each of the silver particles (2). The organic compound can suppress the aggregation of the silver particles (2). The composition has a cake-like form. The ratio of the amount of the organic compound relative to the total amount of the composition is 2 to 15% by mass inclusive.
Inventors:
KIM Insoo (())
キム インスー (())
LEE Chang-Gun (())
キム インスー (())
LEE Chang-Gun (())
Application Number:
JP2010/067858
Publication Date:
June 03, 2011
Filing Date:
October 12, 2010
Export Citation:
Assignee:
TOKUSEN KOGYO CO., LTD. (1081, Minamiyama Sumiyoshi-cho Ono-cit, Hyogo 61, 〒6751361, JP)
トクセン工業株式会社 (〒61 兵庫県小野市住吉町南山１０８１番地 Hyogo, 〒6751361, JP)
KIM Insoo (())
キム インスー (())
トクセン工業株式会社 (〒61 兵庫県小野市住吉町南山１０８１番地 Hyogo, 〒6751361, JP)
KIM Insoo (())
キム インスー (())
International Classes:
B22F1/02; B22F1/00; B22F9/26; H01B1/22; H01B5/00; H01B13/00
Attorney, Agent or Firm:
OKA Kengo et al. (OKA & PARTNERS, 8th Floor Sakae Bldg., 1-1, Motomachi-dori 6-chome, Chuo-k, Kobe-shi Hyogo 22, 〒6500022, JP)
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