COMPOSITION FOR COPPER FILM FORMATION AND COPPER FILM PRODUCTION METHOD USING SAME

Title:

COMPOSITION FOR COPPER FILM FORMATION AND COPPER FILM PRODUCTION METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/012209

Kind Code:

A1

Abstract:

Provided is a composition for copper film formation that: contains 0.1-3.0 mol/kg of a copper formate or a hydrate thereof, a diol compound that is represented by formula (1), and a piperidine compound that is represented by formula (2); and that has a diol compound content in the range of 0.1-6.0 mol/kg and a piperidine compound content in the range of 0.1-6.0 mol/kg when the content of the copper formate or the hydrate thereof is 1 mol/kg. The composition for copper film formation is in a solution state that does not contain any solid phases such as fine particles, and makes it possible to obtain a copper film having sufficient conductivity by applying said composition on a substrate and heating at a temperature of less than 200 °C.

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Inventors:

ABE TETSUJI (JP)
SAITO KAZUYA (JP)

Application Number:

PCT/JP2014/069150

Publication Date:

January 29, 2015

Filing Date:

July 18, 2014

Export Citation:

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Assignee:

ADEKA CORP (JP)

International Classes:

C23C18/08

Foreign References:

JP2010242118A	2010-10-28
JP2009256218A	2009-11-05
JP2012112022A	2012-06-14

Attorney, Agent or Firm:

KONDO Rieko et al. (JP)
Kondo Toshihide child (JP)

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