Title:
COMPOSITION AND CURED ARTICLE COMPRISING INORGANIC PARTICLES AND EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, USE FOR SAME, AND PRODUCTION METHOD FOR EPOXY COMPOUND HAVING ALKOXYSILYL GROUP
Document Type and Number:
WIPO Patent Application WO/2013/180375
Kind Code:
A1
Abstract:
The present invention relates to: a composition and a cured article comprising inorganic particles together with an alkoxysilyl-based epoxy compound which does not require a separate silane coupling agent and exhibits outstanding heat resistance, and more specifically a low coefficient of thermal expansion (CTE) and a high glass transition temperature or no Tg in a composite material; and a use for same. The present invention provides: inorganic particles and an alkoxysilyl-based epoxy compound; and an epoxy composition comprising an epoxy compound, inorganic particles and a curing agent; and a cured article of same and a use for same. A composite article of the composition comprising the inorganic particles and the alkoxysilyl-based epoxy compound of the present invention exhibits outstanding heat resistance, which is to say a low CTE and high glass transition temperature or no Tg, as the chemical bonding efficiency is improved during epoxy composite formation, not only due to chemical bonding of a filler material and the alkoxysilyl groups in the alkoxysilyl-based epoxy compound but also due to chemical bonding between the alkoxysilyl groups of the alkoxysilyl-based epoxy compound.
Inventors:
CHUN HYUN-AEE (KR)
PARK SU-JIN (KR)
PARK SOOK-YEON (KR)
KIM YUN-JU (KR)
TAK SANG-YONG (KR)
PARK SUNG-HWAN (KR)
KANG KYUNG-NAM (KR)
PARK SU-JIN (KR)
PARK SOOK-YEON (KR)
KIM YUN-JU (KR)
TAK SANG-YONG (KR)
PARK SUNG-HWAN (KR)
KANG KYUNG-NAM (KR)
Application Number:
PCT/KR2013/001211
Publication Date:
December 05, 2013
Filing Date:
February 15, 2013
Export Citation:
Assignee:
KOREA IND TECH INST (KR)
International Classes:
C07F7/08; C07D303/12; C07D407/12
Foreign References:
| KR20110043719A | 2011-04-27 | |||
| JP3077695B1 | 2000-08-14 | |||
| KR20110104918A | 2011-09-23 |
Other References:
ZHAOA, XIONG-YAN ET AL.: "Review of polymer materials with low dielectric constant", POLYMER INTERNATIONAL, vol. 59, May 2010 (2010-05-01), pages 597 - 606, XP055163168
FRAGA, FRANCISCO ET AL.: "Influence of the filler CaC03 on the cure kinetic of the epoxy network diglycidyl ether of bisphenol a (BADGE n = 0) with isophorone diamine", JOURNAL OF APPLIED POLYMER SCIENCE, vol. 114, 1 December 2009 (2009-12-01), pages 3338 - 3342, XP055163171
FRAGA, FRANCISCO ET AL.: "Influence of the filler CaC03 on the cure kinetic of the epoxy network diglycidyl ether of bisphenol a (BADGE n = 0) with isophorone diamine", JOURNAL OF APPLIED POLYMER SCIENCE, vol. 114, 1 December 2009 (2009-12-01), pages 3338 - 3342, XP055163171
Attorney, Agent or Firm:
C&S PATENT AND LAW OFFICE (Daelim Acrotel13 Eonju-ro 30-gil,Gangnam-gu, Seoul 135-971, KR)
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