Title:
COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/038664
Kind Code:
A1
Abstract:
Provided is a composition containing a crosslinking agent and at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole, and a polybenzoxazole precursor, said composition having an excellent storage stability. Further provided are a cured film using the composition, a method for manufacturing a cured film, a method for manufacturing a semiconductor device, and a semiconductor device. The composition contains: at least one type of resin comprising a polyimide precursor, a polyimide, a polybenzoxazole precursor, and a polybenzoxazole; a crosslinking agent; a first solvent that dissolves the resin in a proportion of at least 5 mass% at 25°C, said first solvent being selected from alcohols, esters, ketones, ethers, sulfur-containing compounds, carbonates, and ureas; and a second solvent that has a solubility parameter distance of 3.0-11.0 from the first solvent.
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Inventors:
KOYAMA ICHIRO (JP)
SHIBUYA AKINORI (JP)
IWAI YU (JP)
SHIBUYA AKINORI (JP)
IWAI YU (JP)
Application Number:
PCT/JP2016/074924
Publication Date:
March 09, 2017
Filing Date:
August 26, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/08; C08F2/44; C08K5/33; C08L79/04; G03F7/004; G03F7/027; G03F7/031; G03F7/037; G03F7/20
Domestic Patent References:
| WO2011129406A1 | 2011-10-20 |
Foreign References:
| JP2001139806A | 2001-05-22 | |||
| US20150168835A1 | 2015-06-18 | |||
| JP2015141303A | 2015-08-03 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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