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Patent Searching and Data


Title:
COMPOSITION, CURED PRODUCT AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/116948
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a composition that has excellent heat resistance and excellent adhesiveness. The present invention also addresses the problem of providing: a cured product which is obtained by curing this composition; and a laminate which contains this cured product. The present invention also addresses the problem of providing a heat-resistant material, a heat-resistant member, an electronic material and an electronic member, each of which contains this composition. The above-mentioned problems are solved by providing a composition that contains: a (meth)allyl group-containing maleimide compound which is characterized by having a structure that has one or more benzene rings and by having one or more groups each having a (meth)allyl group and one or more groups each having a maleimide group; and a hydroxyl group-containing maleimide compound which is characterized by having a structure that has one or more benzene rings and by having one or more groups each having a hydroxyl group and one or more maleimide groups.

Inventors:
OTSU MASATO (JP)
ARITA KAZUO (JP)
SUZUKI ETSUKO (JP)
YAMAGUCHI JUNJI (JP)
SHIMONO TOMOHIRO (JP)
Application Number:
PCT/JP2017/044865
Publication Date:
June 28, 2018
Filing Date:
December 14, 2017
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F222/40; C08G59/62; C08J5/24; H01L23/14; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
WO2017209237A12017-12-07
WO2017209236A12017-12-07
Foreign References:
JPS625953A1987-01-12
JP2001503040A2001-03-06
CN1896058A2007-01-17
JP2015193628A2015-11-05
Other References:
POLYMER, vol. 37, no. 16, 1996, pages 3721 - 3727
"Proceedings of the National Academy of Sciences", PHYSICAL SCIENCES, vol. 71, no. 1, 2001, pages 5 - 12
See also references of EP 3560968A4
Attorney, Agent or Firm:
KONO Michihiro (JP)
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