Title:
COMPOSITION FOR CURED RESINS, CURED PRODUCT OF SAID COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, METHOD FOR PRODUCING SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/027257
Kind Code:
A1
Abstract:
[Problem] To provide: a composition for cured resins, which has excellent fast curing properties, and which is used for the purpose of achieving a highly heat-resistant cured product; a cured product of this composition; a method for producing this composition for cured resins; and a method for producing this cured product. In addition, to provide a semiconductor device which uses this cured product as a sealing material.
[Solution] A composition for cured resins according to the present invention contains: (A) at least one polyfunctional benzoxazine compound which has at least two benzoxazine rings, and which is selected from among polyfunctional benzoxazine compounds having a structural unit of formula (1) and polyfunctional benzoxazine compounds having a structure represented by formula (2); (B) a polyfunctional epoxy compound which has at least one norbornane structure and at least two epoxy groups; (C) a curing agent; and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene.
Inventors:
NISHITANI YOSHINORI (JP)
SATO TATSUKI (JP)
MINAMI MASAKI (JP)
SATO TATSUKI (JP)
MINAMI MASAKI (JP)
Application Number:
PCT/JP2019/030178
Publication Date:
February 06, 2020
Filing Date:
August 01, 2019
Export Citation:
Assignee:
JXTG NIPPON OIL & ENERGY CORP (JP)
International Classes:
C08G59/40; C08G59/24; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2017188448A1 | 2017-11-02 | |||
WO2018105743A1 | 2018-06-14 | |||
WO2018181857A1 | 2018-10-04 |
Foreign References:
JP2015535865A | 2015-12-17 | |||
JPH05194711A | 1993-08-03 | |||
JP2012067177A | 2012-04-05 | |||
JP2011140465A | 2011-07-21 | |||
JP2000351882A | 2000-12-19 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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