Title:
COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING
Document Type and Number:
WIPO Patent Application WO/2006/057392
Kind Code:
A1
Abstract:
A composition for dip forming which can give a dip-formed molding which has a satisfactory texture, is excellent in tensile strength and flexural fatigue resistance, and is less apt to color even when worn and used in working for long. The composition for dip forming is obtained by converting an organic peroxide which is solid at ordinary pressure and 30°C to an aqueous dispersion in the presence of a surfactant and a polymeric protective colloid, adding the dispersion to a conjugated diene rubber latex, and aging the mixture. The organic peroxide preferably is dibenzoyl peroxide or dilauroyl peroxide.
Inventors:
Kodama, Kazumi c/o ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-k, Tokyo 46, 10082, JP)
Application Number:
PCT/JP2005/021825
Publication Date:
June 01, 2006
Filing Date:
November 28, 2005
Export Citation:
Assignee:
ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-ku Tokyo, 46, 10082, JP)
Kodama, Kazumi c/o ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-k, Tokyo 46, 10082, JP)
Kodama, Kazumi c/o ZEON CORPORATION (6-2 Marunouchi 1-chome, Chiyoda-k, Tokyo 46, 10082, JP)
International Classes:
C08L9/10; B29C41/14; C08J5/02; C08K5/14; C08K9/04
Attorney, Agent or Firm:
Yamashita, Akihiko c/o Tokyo, Central Patent Firm (4th Floor Oak Building Kyobashi, 16-10,
Kyobashi 1-chome, Chuou-k, Tokyo 31, 10400, JP)
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