COMPOSITION FOR ELECTROLESS PLATING UNDERLYING MEMBRANE

Title:

COMPOSITION FOR ELECTROLESS PLATING UNDERLYING MEMBRANE

Document Type and Number:

WIPO Patent Application WO/2019/013179

Kind Code:

A1

Abstract:

This composition for an electroless plating underlying membrane contains (A) a conductive polymer, (B) one or more resins selected from the group consisting of polyester polyol resins and polyether polyol resins, and (C) a polyisocyanate compound.

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Inventors:

HACHIYA SATOSHI (JP)
FUKATSU FUMIOKI (JP)

Application Number:

PCT/JP2018/025933

Publication Date:

January 17, 2019

Filing Date:

July 09, 2018

Export Citation:

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Assignee:

IDEMITSU KOSAN CO (JP)

International Classes:

C23C18/20; B32B15/095; C08G18/42; C08G18/48; C08G18/80; C08G73/00; C09D5/00; C09D7/65; C09D163/00; C09D175/04; C09D175/06; C09D175/08; C23C18/26

Foreign References:

JP2015034317A	2015-02-19
JP2002026014A	2002-01-25
EP0457180A2	1991-11-21

Attorney, Agent or Firm:

HEIWA INTERNATIONAL PATENT OFFICE (JP)

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