Title:
COMPOSITION FOR ELECTROMAGNETIC SHIELDING, SHEET FOR ELECTROMAGNETIC SHIELDING, SINTERED BODY FOR ELECTROMAGNETIC SHIELDING, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/060525
Kind Code:
A1
Abstract:
A composition for electromagnetic shielding according to the present invention contains metal particles A, metal particles B that have a lower melting point than the metal particles A, and a resin; and the metal particles A and the metal particles B are able to be transient liquid phase sintered with each other.
Inventors:
YAMAGISHI HIDEAKI (JP)
MASUDA HIROSHI (JP)
SONE KEITA (JP)
SUKATA SHINICHIROH (JP)
MASUDA HIROSHI (JP)
SONE KEITA (JP)
SUKATA SHINICHIROH (JP)
Application Number:
PCT/JP2020/036419
Publication Date:
April 01, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/00; B22F9/00; C08K3/08; C08L101/00; H05K9/00; C22C12/00
Domestic Patent References:
| WO2018168187A1 | 2018-09-20 |
Foreign References:
| JP2013510240A | 2013-03-21 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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