Title:
COMPOSITION AND ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/261995
Kind Code:
A1
Abstract:
Provided is a composition that can be used to etch a metal layer, e.g. a copper layer, and that makes it possible to form a fine pattern that has excellent dimensional precision and little cross-sectional narrowing of fine lines while suppressing the generation of a residual film. A composition that is an aqueous solution that contains (A) 0.1–25 mass% of at least one type of component selected from the group that consists of cupric ions and ferric ions, (B) 0.1–30 mass% of chloride ions, (C) 0.01–10 mass% of a compound that is represented by general formula (1) and has a number average molecular weight of 350–1,200, (D) 0.01–10 mass% of at least one type of component selected from the group that consists of unsaturated carboxylic acids and salts and anhydrides thereof, and water.
Inventors:
ABE TETSUJI (JP)
NOGUCHI YUTA (JP)
NOGUCHI YUTA (JP)
Application Number:
PCT/JP2020/022859
Publication Date:
December 30, 2020
Filing Date:
June 10, 2020
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C23F1/18; H01L21/306; H05K3/06
Foreign References:
| JPH09209178A | 1997-08-12 | |||
| JPH09241870A | 1997-09-16 | |||
| JP2001200380A | 2001-07-24 | |||
| JP2003138389A | 2003-05-14 | |||
| JP2004256901A | 2004-09-16 | |||
| JP2011017053A | 2011-01-27 | |||
| JP2012140651A | 2012-07-26 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
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