Title:
COMPOSITION, FILM, CIRCUIT SHEET, AND SENSOR SHEET
Document Type and Number:
WIPO Patent Application WO/2024/070897
Kind Code:
A1
Abstract:
With regard to a film for protecting the circuit wiring or the sensor electrode of a circuit sheet or a sensor sheet, the present invention makes it possible to form a protective film which has reduced thickness and has an exceptional ability to protect the circuit wiring or the sensor electrode. The present invention also obtains a composition for forming said film. The present invention provides a composition that contains a COP resin or a COC resin, and an epoxy group–containing condensed polycyclic hydrocarbon monomer. The present invention alternatively provides a composition that contains a COP resin or a COC resin, a physical property adjusting material, and an epoxy group–containing condensed polycyclic hydrocarbon monomer. The present invention further provides a film that comprises the composition.
Inventors:
MIYANAGA KANAE (JP)
Application Number:
PCT/JP2023/034344
Publication Date:
April 04, 2024
Filing Date:
September 21, 2023
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L63/00; C08G59/20; C08L45/00; C09D7/63; C09D123/00; H05K3/28
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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